10 Layers FR4 HDI PCB Papa me nā manamana gula ma ENIG me Blue Solder Mask
ʻIke hana
| Hōʻike No. | PCB-A8 |
| Puke halihali | Hoʻopaʻa ʻumehana |
| Palapala hōʻoia | UL, ISO9001 & ISO14001, RoHS |
| Palapala noi | Mea uila uila |
| Wahi liʻiliʻi/Line | 0.075mm/3mil |
| Kapa Hana Hana | 50,000 sqm / mahina |
| HS Code | 853400900 |
| Ke kumu | Hana ʻia ma Kina |
Hōʻike huahana
Papa Kaapuni PCB me UL, SGS, ISO palapala
Hoʻokahi, ʻaoʻao ʻelua a me ka PCB multi-layer
Kanu/makapo Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole
HASL me ke alakaʻi ʻole, Kaiapuni Gula/ Kālā/Tina, OSP, Pale gula/manamana, Peelable mask
Hoʻopili nā Papa Kaapuni Paʻi i ka IPC Class 2 & 3 maʻamau PCB honua
Loaʻa ka nui mai ka prototype a hiki i ka hana nui a me ka nui
100% E-Ho'āʻo
| 'ikamu | Kapa Hana Hana |
| Helu Lapa | 1-20 papa |
| Mea waiwai | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. |
| Mānoanoa papa | 0.10mm-8.00mm |
| Nui Nui | 600mmX1200mm |
| Papa Outline tolerance | +0.10mm |
| Mānoanoa hoʻomanawanui (t≥0.8mm) | ±8% |
| Mānoanoa hoʻomanawanui (t<0.8mm) | ± 10% |
| Mānoanoa Layer Insulation | 0.075mm--5.00mm |
| Laina liʻiliʻi | 0.075mm |
| Wahi liʻiliʻi | 0.075mm |
| Ka Manoanoa keleawe o waho | 18um--350um |
| Mānoanoa keleawe o loko | 17um--175um |
| Luwaha wili (Mechanical) | 0.15mm--6.35mm |
| Hole Hoʻopau (Mechanical) | 0.10mm-6.30mm |
| Ka hoʻomanawanui ʻana (Mechanical) | 0.05mm |
| Kakau inoa (Mechanical) | 0.075mm |
| ʻAspect Ratio | 16:1 |
| ʻAno Māka Solder | LPI |
| SMT Mini.Solder Mask Laulā | 0.075mm |
| Mini.Hoʻomaʻemaʻe Palekana Solder | 0.05mm |
| Anawaena Puka Puka | 0.25mm--0.60mm |
| Ka hoʻomalu impedance Ka hoʻomanawanui | ± 10% |
| Hoʻopau ʻili / lapaʻau | HASL, ENIG, Chem, Tin, Gula Flash, OSP, Manalima Gula |
ʻO ka moʻolelo o ka hui
ABIS Circuits Co., Ltdi hoʻokumu ʻia i ka makahiki 2006, Aia ma Shenzhen, aia kā mākou hui ma kahi o 1100 mau limahana a me ʻelua mau papa hana PCB me kahi 50000 square meters.
Hoʻohana nui ʻia kā mākou huahana ma ke kahua o Industrial Control, Telecommunication, Automotive products, Medical, Consumer, Security, a me nā mea ʻē aʻe.
I kēia manawa ua hala mākou i ka ISO9001, ISO14001, UL, a me nā mea ʻē aʻe, Me ka hana paʻa mau o kā mākou limahana a me ke kākoʻo mau ʻana mai nā mea kūʻai aku ma ka home a ma waho, hiki iā mākou ke hāʻawi i nā papa 20, Blind and buried Board, high-precision (Rogers), ʻO TG kiʻekiʻe, Alu-base a me nā papa maʻalahi i kā mākou mea kūʻai aku me ka huli wikiwiki a me ka pae kiʻekiʻe.
| hale hana: Wahi hale hana: (I) 10000 mika huinaha (II) 60000 mika huinaha Nā limahana: (I) 300 kanaka mana (II) 900 kanaka mana Eng.ʻenehana: (I) 20 QA QC Engineers (II) 60 QA, QC Engineers |  |
Kaʻina hana PCB
Q/T Lead Time
| Māhele | Manawa alakai wikiwiki loa | Manawa alakai ma'amau |
| ʻaoʻao ʻelua | 24 hola | 120 hola |
| 4 Papahana | 48 hola | 172 hola |
| 6 Papahana | 72 hola | 192 hola |
| 8 Papahana | 96 hola | 212 hola |
| 10 Papa | 120 hola | 268 hola |
| 12 Papa | 120 hola | 280 hola |
| 14 Papahana | 144 hola | 292 hola |
| 16-20 Papa | Ma muli o nā koi kiko'ī | |
| Ma luna o 20 Layer | Ma muli o nā koi kiko'ī | |
ʻO ka neʻe ʻana o ABIS e hoʻomalu iā FR4 PCBS
Hoomakaukau Puka
Ke wehe pono nei i ka ʻōpala a me ka hoʻoponopono ʻana i nā ʻāpana mīkini drill: ma mua o ka hoʻopili ʻana me ke keleawe, nānā nui ʻo ABIS i nā puka āpau ma kahi FR4 PCB i mālama ʻia e wehe i nā ʻōpala, nā hewa ʻole o ka ʻili, a me ka epoxy smear, ʻo nā lua maʻemaʻe e hōʻoia i ka paʻa pono ʻana o ka plating i nā paia puka. .no hoi, i ka hoomaka ana o ke kaʻina hana, drill machine parameter ua hoʻoponopono pololei.
Hoʻomākaukau ʻili
Hoʻopau me ke akahele: e ʻike mua kā mākou poʻe ʻenehana loea ʻo ke ala wale nō e pale aku ai i kahi hopena maikaʻi ʻole ʻo ka manaʻo ʻana i ka pono o ka lawelawe kūikawā a me ka hana ʻana i nā hana kūpono e hōʻoia i ka hana pono a me ka pololei.
Uku Hoonui wela
Maʻa i ka hana ʻana i nā mea like ʻole, hiki iā ABIS ke kālailai i ka hui ʻana i mea e maopopo ai ua kūpono ia.a laila mālama i ka hilinaʻi lōʻihi o ka CTE (coefficient of thermal expansion), me ka CTE haʻahaʻa, ʻoi aku ka liʻiliʻi o ka pale ʻana i nā lua mai ka hoʻololi pinepine ʻana o ke keleawe e hoʻopili ai i nā pilina o loko.
Ka hoʻonui ʻana
Hoʻonui ʻia ka mana ʻo ABIS i ka circuitry e nā pākēneka i ʻike ʻia ma ka kali ʻana i kēia nalowale i hiki ai i nā papa ke hoʻi i ko lākou mau ana i hoʻolālā ʻia ma hope o ka pau ʻana o ka pōʻai lamination.no hoi, ka hoʻohana 'ana i ka baseline scaling paipai 'ana i ka hui 'ana me ka 'ikepili kaʻina hana helu i loko o ka hale, e dial-i nā kumu unahi e like me ka manawa i loko o ia wahi manufacturing.
Mīkini
Ke hiki mai ka manawa e kūkulu ai i kāu PCB, e hōʻoia ʻo ABIS e koho ʻoe i nā lako kūpono a me ka ʻike e hana pono ai i ka hoʻāʻo mua.
Nā hiʻohiʻona-ʻO kā mākou huahana pono
Ma luna o 15 mau makahiki ʻike i ka mea hana ma PCB lawelawe kahua
ʻO ka nui o ka hana ʻana e hōʻoia i ka haʻahaʻa o kāu kumukūʻai kūʻai.
ʻO ka laina hana kiʻekiʻe e hōʻoiaʻiʻo i ka maikaʻi paʻa a me ke ola lōʻihi
100% ho'āʻo no nā huahana PCB maʻamau
One-stop Service, hiki iā mākou ke kōkua i ke kūʻai ʻana i nā ʻāpana
Misiona Pono ABIS
ʻO ka helu o nā mea e hiki mai ana ma luna o 99.9%, ʻo ka helu o ka nui o ka hōʻole ʻana ma lalo o 0.01%.
Mālama nā ʻoihana i hōʻoia ʻia e ABIS i nā kaʻina hana nui e hoʻopau i nā pilikia āpau ma mua o ka hana ʻana.
Hoʻohana ʻo ABIS i nā polokalamu holomua e hana i ka loiloi DFM nui ma nā ʻikepili e hiki mai ana, a hoʻohana i nā ʻōnaehana hoʻokele maikaʻi i ka wā o ke kaʻina hana.
Hana ʻo ABIS i ka 100% nānā ʻike a me AOI a me ka hoʻokō ʻana i ka hoʻāʻo uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing and ionic cleanliness testing.
Palapala
FAQ
ʻO ka hapa nui o lākou mai Shengyi Technology Co., Ltd. (SYTECH), ʻo ia ka lua o ka mea hana CCL nui loa ma ka honua e pili ana i ka nui o ke kūʻai aku, mai 2013 a 2017. Ua hoʻokumu mākou i nā pilina lōʻihi o ka hui ʻana mai 2006. ʻO ka FR4 resin material (Model S1000-2, S1141, S1165, S1600) hoʻohana nui ʻia no ka hana ʻana i nā papa kaapuni paʻi hoʻokahi a me ʻelua ʻaoʻao a me nā papa ʻāpana-nui.Eia nā kikoʻī no kāu kuhikuhi.
l No FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA
l No CEM-1 & CEM 3: Sheng Yi, Papa Alii
l No ke kiʻekiʻe pinepine: Sheng Yi
l No ka UV Cure: Tamura, Chang Xing ( * Loaʻa ke kala: Green) Solder no ka ʻaoʻao hoʻokahi
l No ke kiʻi wai wai: Tao Yang, Kūʻē (Wet Film)
l Chuan Yu ( * Loaʻa nā kala: Keʻokeʻo, Imaginable Solder Yellow, Purple, Red, Blue, Green, Black)
E loaʻa i kēlā me kēia mea kūʻai ke kūʻai aku iā ʻoe.Ko makou hola hana: AM 9:00-PM 19:00(Beijing Time) mai Poakahi a Poalima.E pane koke mākou i kāu leka uila i ko mākou manawa hana.A hiki iā ʻoe ke hoʻokaʻaʻike i kā mākou kūʻai aku ma ke kelepona inā wikiwiki.
ʻAʻole, ʻaʻole hiki iā mākou ke ʻae i nā faila kiʻi, inā ʻaʻohe ou faila Gerber, hiki iā ʻoe ke hoʻouna mai iā mākou i kahi laʻana e kope ai.
Kaʻina hana kope PCB&PCBA:
E nānā a puni ʻoe.No laila, nui nā huahana mai Kina.ʻIke loa, he mau kumu kēia.ʻAʻole ia e pili ana i ke kumukūʻai.
Hoʻomākaukau koke ʻia nā huaʻōlelo.
Hoʻopau koke ʻia nā kauoha hana.Hiki iā ʻoe ke hoʻolālā i nā kauoha i hoʻonohonoho ʻia no nā mahina ma mua, hiki iā mākou ke hoʻonohonoho koke iā lākou ke hōʻoia ʻia ʻo PO.
Ua hoʻonui nui ʻia ke kaulahao lako.ʻO ia ke kumu hiki iā mākou ke kūʻai i kēlā me kēia ʻāpana mai kahi hoa hana kūikawā me ka wikiwiki.
ʻO nā limahana maʻalahi a makemake.ʻO ka hopena, ʻae mākou i kēlā me kēia kauoha.
24 lawelawe pūnaewele no nā pono koʻikoʻi.Nā hola hana o +10 hola i ka lā.
Nā koina haʻahaʻa.ʻAʻohe kumukūʻai huna.Mālama i nā limahana, luna a me ka logistic.
Nānā i loko o 12 hola.Ke nānā ʻia ka nīnau a Engineer a me ka faila hana, e hoʻomaka mākou i ka hana.
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini ʻeleʻele metallograghic
f), AOI (Nānā Optical Aunoa)
ʻAʻohe koi MOQ no ABIS no PCB a i ʻole PCBA.
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl e like me ka hoʻāʻo ʻana i ka uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
Eʻoluʻolu e hoʻouna i nā nīnau kiko'ī iā mākou, e like me ka helu helu, ka nui no kēlā me kēia mea, noi maikaʻi, logo, nā hua'ōlelo uku, ke ala lawe, kahi hoʻokuʻu, a me nā mea'ē aʻe.
| Iecaianoaaiiuo hiki o wela-kūʻai huahana | |
| ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop | Hale Hana PCB Aluminum |
| Hiki i ka ʻenehana | Hiki i ka ʻenehana |
| Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON | Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe |
| Layer: 1 papa i 20 Layer | Layer: 1 papa a me 2 Layer |
| Min.line laula: 3mil/3mil(0.075mm/0.075mm) | Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole nui: 0.1mm (dirilling puka) | Min.Ka nui o ka puka: 12mil(0.3mm) |
| Max.Nui papa: 1200mm* 600mm | Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in) |
| Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm | Pau ka mānoanoa o ka papa: 0.3 ~ 5mm |
| Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) | Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz) |
| NPTH Hole Hoʻomanawanui: +/-0.075mm, PTH hole hoʻomanawanui: +/-0.05mm | Ka hoʻomanawanui kūlana puka: +/-0.05mm |
| Hoʻomanawanui Outline: +/-0.13mm | Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm |
| Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. | Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc |
| Ka hoʻomanawanui ʻana o ka Impedance: +/-10% | Noho ka mānoanoa hoʻomanawanui: +/-0.1mm |
| Hiki ke hana: 50,000 sqm / mahina | MC PCB Hiki i ka hana: 10,000 sqm / mahina |
