Hoʻopilikino ʻia ʻo 4 Layers Rigid-Flex PCB circuit board Kina FPC
ʻIke kumu
| Hōʻike No. | PCB-A6 |
| Puke halihali | Hoʻopaʻa ʻumehana |
| Palapala hōʻoia | UL, ISO9001 & ISO14001, RoHS |
| Wahi liʻiliʻi/Line | 0.075mm/3mil |
| Ka hoʻomalu impedance | 100±10% |
| Kapa Hana Hana | 720,000 M2/makahiki |
| Ke kumu | Hana ʻia ma Kina |
| Palapala noi | Mea uila uila |
Hōʻike huahana
Pehea ka lawelawe ʻana o ABIS i ke kaapuni ʻoʻoleʻa?
ʻO ka hiki ke hoʻohālikelike i ka hui hope o nā PCB paʻa a maʻalahi e hoʻopili i kahi paʻa huahana ʻo ia ka pono mua o nā papa kaapuni maʻalahi.Eia nā ʻōlelo aʻoaʻo 2 e hoʻokomo i kāu papahana hoʻolālā rigid-flex:
E hoʻonui i ka hilinaʻi o ka trace: ʻO ka piʻi ʻana o nā kaapuni paʻa, ʻoi aku ka maikaʻi o ka delaminate o ke keleawe ma mua o ka papa paʻa.ʻOi aku ka liʻiliʻi o ka hoʻohui keleawe i ka substrate ma mua o kahi FR4 PCB pū kekahi.
E hoʻoikaika i nā traces a me nā vias me nā waimaka: Inā ʻaʻole i hoʻomalu ʻia, ʻo ke kulou ʻana i ka substrate hiki ke alakaʻi i ka delamination a me ka pau ʻole o ka huahana.Hiki ke hoʻoikaika ʻia nā traces a me nā vias i mea e pale ai i ka delamination, e hoʻohua maikaʻi hoʻi i ka hana ʻana ma o ka hāʻawi ʻana i ka hoʻomanawanui wili.
ʻenehana & hiki
| 'ikamu | Spec. |
| Nā ʻāpana | 1~8 |
| Mānoanoa Papa | 0.1mm-8.0mm |
| Mea waiwai | Polymide, PET, PEN, FR4 |
| Nui Nui o ka Panel | 600mm×1200mm |
| Min Hole Nui | 0.1mm |
| Min Laina Laulā/Lua | 3mil(0.075mm) |
| Papa Outline tolerance | 士0.10mm |
| Mānoanoa Layer Insulation | 0.075mm--5.00mm |
| Mānoanoa Hope | 0.0024''-0.16'' (0.06-2.4.00mm) |
| Luwaha wili (Mechanical) | 17um--175um |
| Hole Hoʻopau (Mechanical) | 0.10mm--6.30mm |
| ʻO ka hoʻomanawanui ʻana (Mechanical) | 0.05mm |
| Kakau inoa (Mechanical) | 0.075mm |
| ʻAspect Ratio | 16:1 |
| ʻAno Māka Solder | LPI |
| SMT Mini.Laulā Māka Solder | 0.075mm |
| Mini.Hoʻomaʻemaʻe Palekana Solder | 0.05mm |
| Anawaena Puka Puka | 0.25mm--0.60mm |
| Ka hoʻomanawanui impedance | 士10% |
| Hoʻopau ʻili | ENIG, Kem.Tin/Sn, gula Flash |
| Māka solder | ʻOmaomao/melemele/ʻeleʻele/keʻokeʻo/ʻulaʻula/uliuli |
| Silkscreen | ʻulaʻula/melemele/ʻeleʻele/keʻokeʻo |
| Palapala | UL, ISO 9001, ISO14001, IATF16949 |
| Noi Kuikawa | Puka makapō, manamana gula, BGA, ʻīnika kalapona, pale maka nānā, kaʻina VIP, ka uhi ʻaoʻao, ʻAlua lua |
| Mea Hoolako Mea | Shengyi, ITEQ, Taiyo, etc. |
| Pūʻolo maʻamau | Māmā + Kāpena |
Hiki ke alakai manawa PCB
| Puʻupuʻu liʻiliʻiVolume ≤1 mika mika | Nā lā hana | Nuipa? iecaianoaaiiuo | Nā lā hana |
| ʻaoʻao hoʻokahi | 3-4 | ʻaoʻao hoʻokahi | 8-10 |
| 2-4 papa | 4-5 | 2-4 papa | 10-12 |
| 6-8 papa | 10-12 | 6-8 papa | 14-18 |
Misiona Pono ABIS
ʻO ka helu o nā mea e hiki mai ana ma luna o 99.9%, ʻo ka helu o ka nui o ka hōʻole ʻana ma lalo o 0.01%.
Mālama nā ʻoihana i hōʻoia ʻia e ABIS i nā kaʻina hana nui e hoʻopau i nā pilikia āpau ma mua o ka hana ʻana.
Hoʻohana ʻo ABIS i nā polokalamu holomua e hana i ka loiloi DFM nui ma nā ʻikepili e hiki mai ana, a hoʻohana i nā ʻōnaehana hoʻokele maikaʻi i ka wā o ke kaʻina hana.
Hana ʻo ABIS i ka 100% nānā ʻike a me AOI a me ka hoʻokō ʻana i ka hoʻāʻo uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing and ionic cleanliness testing.
Palapala Alanui ʻenehana
| ʻenehana | 2019 | 2020 | 2021 |
| Papahana | 20 | 26 | 32 |
| ʻO ka mānoanoa papa nui mm | 6 | 7 | 8 |
| Mānoanoa papa min mm | 0.4 | 0.3 | 0.2 |
| ʻO ka nui o ka paneli / ka nui o nā ʻāpana mm | 610*910 /580*850 | 620*1000 /580*950 | 620*1000 /580*950 |
| Min Core mānoanoa mm (me ke keleawe ʻole) | 0.075 | 0.05 | 0.05 |
| ʻOz ka mānoanoa keleawe kiʻekiʻe | Papa loko:5oz； Papa waho:6oz | Layer i loko: 6oz; Papa waho:10oz | Papa loko:6oz Papa waho:10oz |
| Min laula/wahi μm | 75/75 | 65/65 | 50/50 |
| Min Mec puka mm | 0.20 | 0.15 | 0.15 |
| Min Laser wili μm | 75 | 75 | 65 |
| Lakiō hiʻohiʻona | 13:1 | 16:1 | 16:1 |
| MAX HDI Lakiō hiʻohiʻona | 0.8:1 | 1:1 | 1:1 |
| Kainoa ma waena o nā papa (≥10L) μm | 125 | 100 | 76 |
| ʻO ka hoʻomanawanui kūʻokoʻa | ± 10% | ±8% | ±8% |
| ʻO ka wili hope μm | ±75 | ±75 | ±75 |
| Kaʻina hana kūikawā | POFV(VIPPO), RF kiʻekiʻe | ||
| Hoʻopau ʻili | ENIG、palapala gula, HASL(HF), OSP, ipu kaiapuni, kala kala | ||
Palapala
FAQ
E loaʻa i kēlā me kēia mea kūʻai ke kūʻai aku iā ʻoe.Ko makou hola hana: AM 9:00-PM 19:00(Beijing Time) mai Poakahi a Poalima.E pane koke mākou i kāu leka uila i ko mākou manawa hana.A hiki iā ʻoe ke hoʻokaʻaʻike i kā mākou kūʻai aku ma ke kelepona inā wikiwiki.
Mea Hoʻolako Nui (FR4): Kingboard (Hong Kong), NanYa (Taiwan), a me Shengyi (Kina), Inā ʻē aʻe, e ʻoluʻolu iā RFQ.
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini ʻeleʻele metallograghic
f), AOI (Nānā Optical Aunoa)
ʻO ka maʻamau 2-3 mau lā no ka hana laʻana.ʻO ka manawa alakaʻi o ka hana nui e hilinaʻi i ka nui o ke kauoha a me ke kau āu e kau ai i ke kauoha.
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini ʻeleʻele metallograghic
f), AOI (Nānā Optical Aunoa)
ISO9001, ISO14001, UL USA & USA Kanada, IFA16949, SGS, RoHS hōʻike.
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl e like me ka hoʻāʻo ʻana i ka uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
Eʻoluʻolu e hoʻouna i nā nīnau kiko'ī iā mākou, e like me ka helu helu, ka nui no kēlā me kēia mea, noi maikaʻi, logo, nā hua'ōlelo uku, ke ala lawe, kahi hoʻokuʻu, a me nā mea'ē aʻe.
ʻOi aku ka nui o ka hāʻawi manawa ma mua o 95%
a), 24 hola huli wikiwiki no ka ʻaoʻao ʻelua prototype PCB
b), 48 hola no 4-8 papa prototype PCB
c), 1 hola no ka ʻōlelo ʻana
d), 2 hola no ka nīnau ʻenekinia/manaʻo hoʻopiʻi
e), 7-24 mau hola no ke kākoʻo ʻenehana / lawelawe kauoha / hana hana
