4 Layers 2.0mm mānoanoa a me 1oz Copper Green Mask Printed Circuit Assembly Board
ʻIke hana
| Hōʻike No. | PCB-A41 |
| Puke halihali | Hoʻopaʻa ʻumehana |
| Palapala hōʻoia | UL, ISO9001 & ISO14001, RoHS |
| Wehewehe | IPC Papa2 |
| Wahi liʻiliʻi/Line | 0.075mm/3mil |
| Ke kumu | Hana ʻia ma Kina |
| Kapa Hana Hana | 720,000 M2 / Makahiki |
| Palapala noi | Mea Hoʻohana Electronics |
Hōʻike huahana
Hoʻolauna ʻia nā papahana PCBA
Hāʻawi ʻo ABIS CIRCUITS Company i nā lawelawe, ʻaʻole nā huahana wale nō.Hāʻawi mākou i nā hāʻina, ʻaʻole wale i nā waiwai.
Mai ka hana ʻana o ka PCB, ʻo nā mea kūʻai aku i nā ʻāpana e ʻākoakoa.Aia pū me:
PCB Kuʻuna
Kiʻi / hoʻolālā PCB e like me kāu kiʻi schematic
hana PCB
Hoʻopili mea hoʻohui
Huipuia PCB
PCBA 100% hoao
ʻO kā mākou pono
ʻO nā mea hana kiʻekiʻe-kiʻekiʻe kiʻekiʻe e koho a waiho i nā mīkini e hiki ke hana ma kahi o 25,000 mau mea SMD i kēlā me kēia hola
Hiki ke hoʻolako maikaʻi loa 60K Sqm i kēlā me kēia mahina-Ke hāʻawi nei i ka haʻahaʻa haʻahaʻa a me ka noi PCB hana, a me nā huahana nui.
'Oihana 'enekinia hui-40 'enekinia a me ko lakou hale ponoi, ikaika ma OEM.Hāʻawi i nā koho maʻalahi ʻelua: ʻike Kuʻuna a me ka ʻike hohonu o ka IPC Class II a me III Standards
Hāʻawi mākou i kahi lawelawe EMS hulina piha i nā mea kūʻai aku e makemake iā mākou e hōʻuluʻulu i ka PCB i PCBA, me nā prototypes, papahana NPI, liʻiliʻi a me ka leo liʻiliʻi.Hiki iā mākou ke hoʻopuka i nā mea āpau no kāu papahana hui PCB.Loaʻa i kā mākou poʻe ʻenekinia a me kā mākou hui sourcing ka ʻike waiwai i ke kaulahao lako a me ka ʻoihana EMS, me ka ʻike hohonu i ka hui SMT e hiki ai ke hoʻoholo i nā pilikia hana āpau.ʻO kā mākou lawelawe he kumu kūʻai, maʻalahi, a hilinaʻi.Ua ʻoluʻolu mākou i nā mea kūʻai aku ma nā ʻoihana he nui e pili ana i ka lāʻau lapaʻau, ʻoihana, automotive a me nā mea hoʻohana uila.
PCBA hiki
| 1 | ʻO ka hui SMT me ka hui BGA |
| 2 | Nā ʻāpana SMD i ʻae ʻia: 0204, BGA, QFP, QFN, TSOP |
| 3 | Kiʻekiʻe o ka mea: 0.2-25mm |
| 4 | ʻO ka pahu liʻiliʻi: 0204 |
| 5 | Min mamao ma waena o BGA: 0.25-2.0mm |
| 6 | Min BGA nui: 0.1-0.63mm |
| 7 | Min QFP wahi: 0.35mm |
| 8 | Ka nui hui min: (X*Y): 50*30mm |
| 9 | Ka nui hui nui: (X*Y): 350*550mm |
| 10 | ʻO ka pololei koho koho: ± 0.01mm |
| 11 | Hiki ke hoʻokomo: 0805, 0603, 0402 |
| 12 | Loaʻa ke kūpono paʻi helu pine kiʻekiʻe |
| 13 | Ka mana SMT i kēlā me kēia lā: 80,000 mau helu |
Hiki - SMT
| Laina | 9(5 Yamaha,4KME) |
| Ka hiki | 52 miliona mau wahi i kēlā me kēia mahina |
| Nui Papa Nui | 457*356mm.(18”X14”) |
| Min Nui o ka mea | 0201-54 sq.mm.(0.084 sq.inch), hoʻohui lōʻihi, CSP,BGA,QFP |
| Ka māmā holo | 0.15 sec/chip,0.7 sec/QFP |
Hiki - PTH
| Laina | 2 |
| Ka laula o ka papa | 400 mm |
| ʻAno | ʻAle pālua |
| Kūlana Pbs | Kākoʻo laina alakaʻi ʻole |
| ʻO ka mahana kiʻekiʻe | 399 degere C |
| Kapu ʻana | mea hoʻohui |
| Wela mua | 3 |
Nā Kaʻina Hana Hana
Loaʻa i nā mea → IQC → Kūʻai → Mea i SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Hoʻouka Laina → Hoʻopaʻa ʻia ma o ka Hole → Wave Soldering → Hoʻopā i luna → 100% Nānā Kiʻi → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packaging → OQC Sampling → Shipping
Ka Mana Mana
| Hoao AOI | Nānā no ka paʻi solder Nānā i nā ʻāpana a hiki i 0201 E nānā i nā ʻāpana nalo, offset, nā ʻāpana hewa, polarity |
| Nānā X-Ray | Hāʻawi ʻo X-Ray i ka nānā hoʻonā kiʻekiʻe o: Nā BGA/Micro BGAs/Nā pūʻolo pālākiō chip / Nā papa ʻole |
| Hoao Kaapuni | Hoʻohana maʻamau ka hoʻāʻo ʻana i loko o ka pōʻai me AOI e hōʻemi ana i nā hemahema hana i hoʻokumu ʻia e nā pilikia ʻāpana. |
| Ho'āʻo mana | Ho'āʻo hana kiʻekiʻe Ka polokalamu polokalamu uila Hoao hana |
Palapala
FAQ
| Māhele | Manawa alakai wikiwiki loa | Manawa alakai ma'amau |
| ʻaoʻao ʻelua | 24 hola | 120 hola |
| 4 Papahana | 48 hola | 172 hola |
| 6 Papahana | 72 hola | 192 hola |
| 8 Papahana | 96 hola | 212 hola |
| 10 Papa | 120 hola | 268 hola |
| 12 Papa | 120 hola | 280 hola |
| 14 Papahana | 144 hola | 292 hola |
| 16-20 Papa | Ma muli o nā koi kiko'ī | |
| Ma luna o 20 Layer | Ma muli o nā koi kiko'ī | |
Pili o nā mea waiwai (BOM) kikoʻī:
a), Nā helu ʻāpana o nā mea hana,
b), helu ʻāpana o nā mea hoʻolako ʻāpana (e laʻa me Digi-key, Mouser, RS)
c), PCBA laʻana kiʻi inā hiki.
d), Ka nui
| Iecaianoaaiiuo hiki o wela-kūʻai huahana | |
| ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop | Hale Hana PCB Aluminum |
| Hiki i ka ʻenehana | Hiki i ka ʻenehana |
| Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON | Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe |
| Layer: 1 papa i 20 Layer | Layer: 1 papa a me 2 Layer |
| Min.line laula: 3mil/3mil(0.075mm/0.075mm) | Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole nui: 0.1mm (dirilling puka) | Min.Ka nui o ka puka: 12mil(0.3mm) |
| Max.Nui papa: 1200mm* 600mm | Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in) |
| Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm | Pau ka mānoanoa o ka papa: 0.3 ~ 5mm |
| Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) | Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz) |
| NPTH Hole Hoʻomanawanui: +/-0.075mm, PTH hole hoʻomanawanui: +/-0.05mm | Ka hoʻomanawanui kūlana puka: +/-0.05mm |
| Hoʻomanawanui Outline: +/-0.13mm | Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm |
| Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. | Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc |
| Ka hoʻomanawanui ʻana o ka Impedance: +/-10% | Noho ka mānoanoa hoʻomanawanui: +/-0.1mm |
| Hiki ke hana: 50,000 sqm / mahina | MC PCB Hiki i ka hana: 10,000 sqm / mahina |
ʻAʻole hiki iā mākoue ae akunā faila kiʻi, inā ʻaʻohe āuGerberfile, hiki iā ʻoe ke hoʻouna mai iā mākou i ka laʻana e kope iā ia.
Kaʻina hana kope PCB&PCBA:
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini ʻeleʻele metallograghic
f), AOI (Nānā Optical Aunoa)
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl e like me ka hoʻāʻo ʻana i ka uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
Nā ʻOihana Nui o ABIS: Ka Mana Hana, Telecommunication, Automotive Products and Medical.ʻO ka Mākeke Nui o ABIS: 90% International Market(40% -50% no USA, 35% no ʻEulopa, 5% no Rūsia a me 5% -10% no Asia Hikina) a me 10% Market Domestic.
ʻOi aku ka nui o ka hāʻawi manawa ma mua o 95%
a), 24 hola huli wikiwiki no ka ʻaoʻao ʻelua prototype PCB
b), 48 hola no 4-8 papa prototype PCB
c), 1 hola no ka ʻōlelo ʻana
d), 2 hola no ka nīnau ʻenekinia/manaʻo hoʻopiʻi
e), 7-24 mau hola no ke kākoʻo ʻenehana / lawelawe kauoha / hana hana
· Me ABIS, hoʻemi nui nā mea kūʻai aku i kā lākou kumukūʻai kūʻai honua.Ma hope o kēlā me kēia lawelawe i hāʻawi ʻia e ABIS, ua hūnā ʻia kahi mālama kālā no nā mea kūʻai aku.
.Loaʻa iā mākou ʻelua mau hale kūʻai, hoʻokahi no prototype, huli wikiwiki, a me ka hana liʻiliʻi.ʻO ka mea ʻē aʻe no ka hana nui no ka papa HDI, me nā limahana ʻoihana akamai loa, no nā huahana kiʻekiʻe me nā kumukūʻai hoʻokūkū a me ka lawe ʻana i ka manawa.
.Hāʻawi mākou i ke kūʻai aku ʻoihana, kākoʻo loea a me ka logistic, ma ke ao holoʻokoʻa me 24 mau hola o ka manaʻo hoʻopiʻi.
