6 Layers FR4 HDI PCB Circuit ma 2oz keleawe me ka Immersion Tin Surface i pau.
ʻIke kumu
| Hōʻike No. | PCB-A12 |
| Puke halihali | Hoʻopaʻa ʻumehana |
| Palapala hōʻoia | UL, ISO9001 & ISO14001, RoHS |
| Palapala noi | Mea uila uila |
| Wahi liʻiliʻi/Line | 0.075mm/3mil |
| Kapa Hana Hana | 50,000 sqm / mahina |
| HS Code | 853400900 |
| Ke kumu | Hana ʻia ma Kina |
Hōʻike huahana
HDI PCB Introduction
Ua wehewehe ʻia ʻo HDI PCB ma ke ʻano he papa kaapuni i paʻi ʻia me ka ʻoi aku ka nui o nā uwila ʻoi aku ka nui ma mua o kahi PCB maʻamau.Loaʻa iā lākou nā laina ʻoi aku ka maikaʻi a me nā hakahaka, nā vias liʻiliʻi a me nā pad hopu, a ʻoi aku ka kiʻekiʻe o ka pā pad pili ma mua o ka hana ma ka ʻenehana PCB maʻamau.Hana ʻia nā PCB HDI ma o nā microvias, kanu ʻia a me ka lamination sequential me nā mea insulation a me nā uea conductor no ke kiʻekiʻe kiʻekiʻe o ke ala.
Nā noi
Hoʻohana ʻia ʻo HDI PCB e hōʻemi i ka nui a me ke kaumaha, a me ka hoʻomaikaʻi ʻana i ka hana uila o ka hāmeʻa.ʻO HDI PCB ka koho maikaʻi loa i ka helu-papa kiʻekiʻe a me ka laminate maʻamau maʻamau a i ʻole nā papa laminated sequentially.Hoʻokomo ʻo HDI i nā vias makapō a kanu ʻia e kōkua i ka mālama ʻana i ka waiwai PCB ma o ka ʻae ʻana i nā hiʻohiʻona a me nā laina e hoʻolālā ʻia ma luna a ma lalo o lākou me ka ʻole o ka pilina.ʻAʻole ʻae ka hapa nui o ka BGA pitch maikaʻi i kēia lā a me nā kapuaʻi ʻāpana flip-chip no ka holo ʻana ma waena o nā pā BGA.ʻO nā makapō a kanu ʻia nā vias e hoʻopili wale i nā papa e koi ana i nā pilina ma kēlā wahi.
ʻenehana & hiki
| 'ikamu | Kapa Hana Hana |
| Helu Lapa | 1-20 papa |
| Mea waiwai | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. |
| Mānoanoa papa | 0.10mm-8.00mm |
| Nui Nui | 600mmX1200mm |
| Papa Outline tolerance | +0.10mm |
| Mānoanoa hoʻomanawanui (t≥0.8mm) | ±8% |
| Mānoanoa hoʻomanawanui (t<0.8mm) | ± 10% |
| Mānoanoa Layer Insulation | 0.075mm--5.00mm |
| Laina liʻiliʻi | 0.075mm |
| Wahi liʻiliʻi | 0.075mm |
| Ka Manoanoa keleawe o waho | 18um--350um |
| Mānoanoa keleawe o loko | 17um--175um |
| Luwaha wili (Mechanical) | 0.15mm--6.35mm |
| Hole Hoʻopau (Mechanical) | 0.10mm-6.30mm |
| Ka hoʻomanawanui ʻana (Mechanical) | 0.05mm |
| Kakau inoa (Mechanical) | 0.075mm |
| ʻAspect Ratio | 16:1 |
| ʻAno Māka Solder | LPI |
| SMT Mini.Solder Mask Laulā | 0.075mm |
| Mini.Hoʻomaʻemaʻe Palekana Solder | 0.05mm |
| Anawaena Puka Puka | 0.25mm--0.60mm |
| Ka hoʻomalu impedance Ka hoʻomanawanui | ± 10% |
| Hoʻopau ʻili / lapaʻau | HASL, ENIG, Chem, Tin, Gula Flash, OSP, Manalima Gula |
Kaʻina hana PCB
Hoʻomaka ke kaʻina hana me ka hoʻolālā ʻana i ka Layout o ka PCB me ka hoʻohana ʻana i kekahi polokalamu hoʻolālā PCB / CAD Tool (Proteus, Eagle, a i ʻole CAD).
ʻO ke koena o nā ʻanuʻu o ka Hana Hana ʻana o kahi Papa Kaapuni Paʻi Paʻi ʻia e like me ka PCB ʻaoʻao hoʻokahi a i ʻole PCB ʻaoʻao ʻelua a i ʻole PCB multi-layer.
Q/T Lead Time
| Māhele | Manawa alakai wikiwiki loa | Manawa alakai ma'amau |
| ʻaoʻao ʻelua | 24 hola | 120 hola |
| 4 Papahana | 48 hola | 172 hola |
| 6 Papahana | 72 hola | 192 hola |
| 8 Papahana | 96 hola | 212 hola |
| 10 Papa | 120 hola | 268 hola |
| 12 Papa | 120 hola | 280 hola |
| 14 Papahana | 144 hola | 292 hola |
| 16-20 Papa | Ma muli o nā koi kiko'ī | |
| Ma luna o 20 Layer | Ma muli o nā koi kiko'ī | |
ʻO ka neʻe ʻana o ABIS e hoʻomalu iā FR4 PCBS
Hoomakaukau Puka
Ke wehe pono nei i ka ʻōpala a me ka hoʻoponopono ʻana i nā ʻāpana mīkini drill: ma mua o ka hoʻopili ʻana me ke keleawe, nānā nui ʻo ABIS i nā puka āpau ma kahi FR4 PCB i mālama ʻia e wehe i nā ʻōpala, nā hewa ʻole o ka ʻili, a me ka epoxy smear, ʻo nā lua maʻemaʻe e hōʻoia i ka paʻa pono ʻana o ka plating i nā paia puka. .no hoi, i ka hoomaka ana o ke kaʻina hana, drill machine parameter ua hoʻoponopono pololei.
Hoʻomākaukau ʻili
Hoʻopau me ke akahele: e ʻike mua kā mākou poʻe ʻenehana loea ʻo ke ala wale nō e pale aku ai i kahi hopena maikaʻi ʻole ʻo ka manaʻo ʻana i ka pono o ka lawelawe kūikawā a me ka hana ʻana i nā hana kūpono e hōʻoia i ka hana pono a me ka pololei.
Uku Hoonui wela
Maʻa i ka hana ʻana i nā mea like ʻole, hiki iā ABIS ke kālailai i ka hui ʻana i mea e maopopo ai ua kūpono ia.a laila mālama i ka hilinaʻi lōʻihi o ka CTE (coefficient of thermal expansion), me ka CTE haʻahaʻa, ʻoi aku ka liʻiliʻi o ka pale ʻana i nā lua mai ka hoʻololi pinepine ʻana o ke keleawe e hoʻopili ai i nā pilina o loko.
Ka hoʻonui ʻana
Hoʻonui ʻia ka mana ʻo ABIS i ka circuitry e nā pākēneka i ʻike ʻia ma ka kali ʻana i kēia nalowale i hiki ai i nā papa ke hoʻi i ko lākou mau ana i hoʻolālā ʻia ma hope o ka pau ʻana o ka pōʻai lamination.no hoi, ka hoʻohana 'ana i ka baseline scaling paipai 'ana i ka hui 'ana me ka 'ikepili kaʻina hana helu i loko o ka hale, e dial-i nā kumu unahi e like me ka manawa i loko o ia wahi manufacturing.
Mīkini
Ke hiki mai ka manawa e kūkulu ai i kāu PCB, e hōʻoia ʻo ABIS e koho ʻoe i nā lako kūpono a me ka ʻike e hana ai
Misiona Pono ABIS
ʻO ka helu o nā mea e hiki mai ana ma luna o 99.9%, ʻo ka helu o ka nui o ka hōʻole ʻana ma lalo o 0.01%.
Mālama nā ʻoihana i hōʻoia ʻia e ABIS i nā kaʻina hana nui e hoʻopau i nā pilikia āpau ma mua o ka hana ʻana.
Hoʻohana ʻo ABIS i nā polokalamu holomua e hana i ka loiloi DFM nui ma nā ʻikepili e hiki mai ana, a hoʻohana i nā ʻōnaehana hoʻokele maikaʻi i ka wā o ke kaʻina hana.
Hana ʻo ABIS i ka 100% nānā ʻike a me AOI a me ka hoʻokō ʻana i ka hoʻāʻo uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing and ionic cleanliness testing.
Palapala
FAQ
ʻO ka hapa nui o lākou mai Shengyi Technology Co., Ltd. (SYTECH), ʻo ia ka lua o ka mea hana CCL nui loa ma ka honua e pili ana i ka nui o ke kūʻai aku, mai 2013 a 2017. Ua hoʻokumu mākou i nā pilina lōʻihi o ka hui ʻana mai 2006. ʻO ka FR4 resin material (Model S1000-2, S1141, S1165, S1600) hoʻohana nui ʻia no ka hana ʻana i nā papa kaapuni paʻi hoʻokahi a me ʻelua ʻaoʻao a me nā papa ʻāpana-nui.Eia nā kikoʻī no kāu kuhikuhi.
No FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA
No CEM-1 & CEM 3: Sheng Yi, Papa Alii
No ke alapine kiʻekiʻe: Sheng Yi
No ka UV Cure: Tamura, Chang Xing ( * Loaʻa ke kala: ʻOmaomao) Solder no ka ʻaoʻao hoʻokahi
No ke kiʻi wai wai: Tao Yang, pale (kiʻiʻoniʻoni wet)
Chuan Yu ( * Loaʻa nā kala: Keʻokeʻo, Imaginable Solder Yellow, Purple, Red, Blue, Green, Black)
), 1 Hola olelo
b), 2 hola o ka manaʻo hoʻopiʻi
c), 7*24 hola kākoʻo ʻenehana
d), 7*24 lawelawe kauoha
e), 7*24 hola hoʻouna
f), 7*24 holo hana
ʻAʻole, ʻaʻole hiki iā mākou ke ʻae i nā faila kiʻi, inā ʻaʻohe ou faila Gerber, hiki iā ʻoe ke hoʻouna mai iā mākou i kahi laʻana e kope ai.
Kaʻina hana kope PCB&PCBA:
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini kikohoʻe metallo graghic
f), AOI (Nānā Optical Aunoa)
Nānā i loko o 12 hola.Ke nānā ʻia ka nīnau a Engineer a me ka faila hana, e hoʻomaka mākou i ka hana.
E nānā a puni ʻoe.No laila, nui nā huahana mai Kina.ʻIke loa, he mau kumu kēia.ʻAʻole ia e pili ana i ke kumukūʻai.
Hoʻomākaukau koke ʻia nā huaʻōlelo.
Hoʻopau koke ʻia nā kauoha hana.Hiki iā ʻoe ke hoʻolālā i nā kauoha i hoʻonohonoho ʻia no nā mahina ma mua, hiki iā mākou ke hoʻonohonoho koke iā lākou ke hōʻoia ʻia ʻo PO.
Ua hoʻonui nui ʻia ke kaulahao lako.ʻO ia ke kumu hiki iā mākou ke kūʻai i kēlā me kēia ʻāpana mai kahi hoa hana kūikawā me ka wikiwiki.
ʻO nā limahana maʻalahi a makemake.ʻO ka hopena, ʻae mākou i kēlā me kēia kauoha.
24 lawelawe pūnaewele no nā pono koʻikoʻi.Nā hola hana o +10 hola i ka lā.
Nā koina haʻahaʻa.ʻAʻohe kumukūʻai huna.Mālama i nā limahana, luna a me ka logistic.
ʻAʻohe koi MOQ no ABIS no PCB a i ʻole PCBA.
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl e like me ka hoʻāʻo ʻana i ka uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
ʻAʻohe koi MOQ no ABIS no PCB a i ʻole PCBA.
| Iecaianoaaiiuo hiki o wela-kūʻai huahana | |
| ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop | Hale Hana PCB Aluminum |
| Hiki i ka ʻenehana | Hiki i ka ʻenehana |
| Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON | Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe |
| Layer: 1 papa i 20 Layer | Layer: 1 papa a me 2 Layer |
| Min.line laula: 3mil/3mil(0.075mm/0.075mm) | Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole nui: 0.1mm (dirilling puka) | Min.Ka nui o ka puka: 12mil(0.3mm) |
| Max.Nui papa: 1200mm* 600mm | Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in) |
| Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm | Pau ka mānoanoa o ka papa: 0.3 ~ 5mm |
| Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) | Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz) |
| NPTH Hole Hoʻomanawanui: +/-0.075mm, PTH hole hoʻomanawanui: +/-0.05mm | Ka hoʻomanawanui kūlana puka: +/-0.05mm |
| Hoʻomanawanui Outline: +/-0.13mm | Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm |
| Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. | Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc |
| Ka hoʻomanawanui ʻana o ka Impedance: +/-10% | Noho ka mānoanoa hoʻomanawanui: +/-0.1mm |
| Hiki ke hana: 50,000 sqm / mahina | MC PCB Hiki i ka hana: 10,000 sqm / mahina |
