Hoʻopilikino ʻia ʻo 6 Layers Rigid-Flex PCB Board me 3.0oz Copper a me ENIG 2u” Hoʻopau ʻili.
ʻIke kumu
| Hōʻike No. | PCB-A35 |
| Puke halihali | Hoʻopaʻa ʻumehana |
| Palapala hōʻoia | UL, ISO9001 & ISO14001, RoHS |
| Wehewehe | IPC Papa2 |
| Wahi liʻiliʻi/Line | 0.075mm/3mil |
| Ka hoʻomalu impedance | 50±10% |
| Kapa Hana Hana | 720,000 M2/makahiki |
| Ke kumu | Hana ʻia ma Kina |
Hōʻike huahana
ʻO ka nānā ʻana i nā papa kaapuni paʻi paʻi paʻa
ʻO ka manaʻo maoli o "rigid-flex" ka hui pū ʻana i nā pono o nā papa maʻalahi a paʻa.ʻIke ʻia ʻo ia ʻelua-ma-hoʻokahi kaapuni i hoʻopili ʻia ma o nā lua i uhi ʻia.Hiki i nā kaʻapuni flexi ʻoi aku ke kiʻekiʻe o ka ʻāpana ʻoiai e kūpono ana i nā wahi liʻiliʻi a ʻano ʻano ʻē.
ʻO nā papa kaapuni paʻi paʻa ʻoʻoleʻa he nui nā ʻāpana o loko i hoʻopili ʻia me ka hoʻohana ʻana i kahi kiʻiʻoniʻoni hoʻopaʻa epoxy pre-preg, e like me kahi kaapuni hikiwawe multilayer.Ua hoʻohana ʻia nā kaapuni ʻo Rigid flex i ka pūʻali koa a me nā ʻoihana aerospace ma mua o 20 mau makahiki.I ka nui o na papa kaapuni kaapuni paakiki.
ʻenehana & hiki
| 'ikamu | Kapa Hana Hana |
| Helu Lapa | 1-32 |
| Mea waiwai | FR-4, High TG FR-4, PTFE, Aluminum Base, Cu base, Rogers, Teflon, etc. |
| Nui Nui | 600mm X1200mm |
| Papa Outline tolerance | ±0.13mm |
| Mānoanoa Papa | 0.20mm--8.00mm |
| Mānoanoa hoʻomanawanui (t≥0.8mm) | ± 10% |
| Mānoanoa Tolerancc(t<0.8mm) | ±0.1mm |
| Mānoanoa Layer Insulation | 0.075mm--5.00mm |
| Iine liʻiliʻi | 0.075mm |
| Wahi liʻiliʻi | 0.075mm |
| Ka Manoanoa keleawe o waho | 18um--350um |
| Mānoanoa keleawe o loko | 17um--175um |
| Luwaha wili (Mechanical) | 0.15mm--6.35mm |
| Hole Hoʻopau (Mechanical) | 0.10mm--6.30mm |
| Ka hoʻomanawanui ʻana (Mechanical) | 0.05mm |
| Kakau inoa (Mechanical) | 0.075mm |
| Aspecl Ratio | 16:01 |
| ʻAno Māka Solder | LPI |
| SMT Mini.Solder Mask Laulā | 0.075mm |
| Mini.Solder Mask Clearance | 0.05mm |
| Anawaena Puka Puka | 0.25mm--0.60mm |
| Ka hoʻomanawanui impedance | 10% |
| Hoʻopau ʻili | HASL/HASL-LF, ENIG, Immersion Tin/Kila, Flash Gula, OSP , Manamana gula, Gula paa |
Hana Hana-(Flex)
| mau mea | hui | ||||||
| Nā papa kiʻekiʻe | Papahana | 10 | |||||
| Mea Kumu (Polymide) | μm | 9, 12, 18, 35, 70 | |||||
| Pepa keleawe | μm | 18,35,70 | |||||
| Mea uhi uhi (Polymide) | μm | 27.5, 37.5, 50, 75 | |||||
| ʻO ka Sima Thermosetting | μm | 13, 25 | |||||
| Nui Nui o ka Panel | mm | 250*800 | 250 * 1500 no 10 mau ʻāpana | ||||
| Ka liʻiliʻi loa o ka Panel | mm | Pili i ka mea kūʻai | |||||
| Mānoanoa Papa Hoʻopau ʻoi loa | mm | 0.7 | |||||
| Mānoanoa Papa Paʻa liʻiliʻi | mm | 0.057mm | |||||
| Ka nui o ka puka hoʻomanawanui | mm | ±0.05mm | |||||
| Ka liʻiliʻi ma o ka Hole | mm | 0.1mm | |||||
| Ka palena iki ma o ka Hole Pad | mm | 0.3mm | 0.25mm Kūikawā | ||||
| Mānoanoa keleawe kumu kiʻekiʻe | OZ | 2 | |||||
| Mānoanoa Kelepona kumu liʻiliʻi | OZ | 1/4 | |||||
| Mānoanoa Pāʻani keleawe | μm | 8-20 | |||||
| PTH Mānoanoa keleawe | μm | 8~20 | |||||
| Laina Laina liʻiliʻi/Spacing | mm | 0.05 | |||||
| Ua Pau ka Ili | / | Ni,Au,Sn | |||||
Hiki ke alakai manawa PCB
| Puʻupuʻu liʻiliʻiVolume ≤1 mika mika | Nā lā hana | Nuipa? iecaianoaaiiuo | Nā lā hana |
| ʻaoʻao hoʻokahi | 3-4 | ʻaoʻao hoʻokahi | 8-10 |
| 2-4 papa | 4-5 | 2-4 papa | 10-12 |
| 6-8 papa | 10-12 | 6-8 papa | 14-18 |
Nā pōmaikaʻi o ABIS
- ʻO nā mea hana kiʻekiʻe-kiʻekiʻe kiʻekiʻe e koho a waiho i nā mīkini e hiki ke hana ma kahi o 25,000 mau mea SMD i kēlā me kēia hola
- Hiki ke hoʻolako maikaʻi loa 60K Sqm i kēlā me kēia mahina-Ke hāʻawi nei i ka haʻahaʻa haʻahaʻa a me ka noi PCB hana, a me ka hana nui.
- 'Oihana 'enekinia hui-40 'enekinia a me ko lakou hale ponoi, ikaika ma OEM.Hāʻawi i nā koho maʻalahi ʻelua: ʻike Kuʻuna a me ka ʻike hohonu o ka IPC Class II a me III Standards
Hāʻawi mākou i kahi lawelawe EMS hulina piha i nā mea kūʻai aku e makemake ana mākou e hōʻuluʻulu i ka PCB i PCBA, me nā prototypes, nā papahana NPI, nā puke liʻiliʻi a me ka liʻiliʻi.Hiki iā mākou ke hoʻopuka i nā mea āpau no kāu papahana hui PCB.Loaʻa i kā mākou poʻe ʻenekinia a me kā mākou pūʻulu sourcing ka ʻike waiwai i ke kaulahao lako a me ka ʻoihana EMS, me ka ʻike hohonu i ka hui SMT e ʻae iā mākou e hoʻoponopono i nā pilikia hana āpau.ʻO kā mākou lawelawe he kumu kūʻai, maʻalahi, a hilinaʻi.Ua hauʻoli mākou i nā mea kūʻai aku ma nā ʻoihana he nui e pili ana i ka lāʻau lapaʻau, ʻoihana, automotive, a me nā mea uila uila.
Palapala
FAQ

Nā ʻOihana Nui o ABIS: Ka Mana Hana, Telecommunication, Automotive Products and Medical.ʻO ka Mākeke Nui o ABIS: 90% International Market(40% -50% no USA, 35% no ʻEulopa, 5% no Rūsia a me 5% -10% no Asia Hikina) a me 10% Market Domestic.
Mea Hoʻolako Nui (FR4): Kingboard (Hong Kong), NanYa (Taiwan), a me Shengyi (Kina), Inā ʻē aʻe, e ʻoluʻolu iā RFQ.
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini ʻeleʻele metallograghic
f), AOI (Nānā Optical Aunoa)
ʻO ka maʻamau 2-3 mau lā no ka hana laʻana.ʻO ka manawa alakaʻi o ka hana nui e hilinaʻi i ka nui o ke kauoha a me ke kau āu e kau ai i ke kauoha.
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini ʻeleʻele metallograghic
f), AOI (Nānā Optical Aunoa)
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl a me ka hoʻokō ʻana i ka hoʻāʻo uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedancecontrol, ka micro-sectioning, ka hoʻāʻo ʻana i ka wela, ka hoʻāʻo solder, ka hoʻāʻo ʻana i ka hilinaʻi, ka hoʻāʻo ʻana i ka pale ʻana., hoʻomaʻemaʻe ionica me ka hoʻāʻo ʻana o ka PCBA.
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl e like me ka hoʻāʻo ʻana i ka uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
ʻAʻohe koi MOQ no ABIS no PCB a i ʻole PCBA.
ʻOi aku ka nui o ka hāʻawi manawa ma mua o 95%
a), 24 hola huli wikiwiki no ka ʻaoʻao ʻelua prototype PCB
b), 48 hola no 4-8 papa prototype PCB
c), 1 hola no ka ʻōlelo ʻana
d), 2 hola no ka nīnau ʻenekinia/manaʻo hoʻopiʻi
e), 7-24 mau hola no ke kākoʻo ʻenehana / lawelawe kauoha / hana hana





