4oz Multilayer FR4 PCB Papa ma ENIG i hoʻohana ʻia i ka ʻOihana Energy me ka papa IPC 3
ʻIke hana
| Hōʻike No. | PCB-A9 |
| Puke halihali | Hoʻopaʻa ʻumehana |
| Palapala hōʻoia | UL, ISO9001 & ISO14001, RoHS |
| Palapala noi | Mea uila uila |
| Wahi liʻiliʻi/Line | 0.075mm/3mil |
| Kapa Hana Hana | 50,000 sqm / mahina |
| HS Code | 853400900 |
| Ke kumu | Hana ʻia ma Kina |
Hōʻike huahana
FR4 PCB Hoʻolauna
Wehewehe
'O FR 'o ia ka "flame-retardant," FR-4 (a i 'ole FR4) he papa inoa NEMA no ke aniani-reinforced epoxy laminate material, he mea i haku 'ia me ka lole fiberglass i ulana 'ia me ka epoxy resin binder e lilo ia i substrate kūpono no na mea uila. ma ka papa kaapuni i paiia.
ʻO nā pono a me nā pōʻino o FR4 PCB
He mea kaulana loa ka mea FR-4 ma muli o kona mau ʻano maikaʻi e hiki ke pōmaikaʻi i nā papa kaapuni paʻi.Ma waho aʻe o ke kumukūʻai a me ka maʻalahi o ka hana ʻana, he insulator uila me ka ikaika dielectric kiʻekiʻe loa.ʻOi aku ka lōʻihi, kūpaʻa i ka wai, kūpaʻa i ka mahana a me ka māmā.
ʻO FR-4 kahi mea pili ākea, kaulana loa no kona kumu kūʻai haʻahaʻa a me ka paʻa ʻana o ka mīkini a me ka uila.ʻOiai e loaʻa ana kēia mea waiwai i nā pōmaikaʻi nui a loaʻa i nā ʻano mānoanoa a me nā nui, ʻaʻole ia ke koho maikaʻi loa no kēlā me kēia noi, ʻoi aku ka nui o nā noi kiʻekiʻe e like me RF a me nā hoʻolālā microwave.
Hoʻolālā PCB papa nui
Hoʻonui hou ka Multilayer PCB i ka paʻakikī a me ka nui o nā hoʻolālā PCB ma o ka hoʻohui ʻana i nā papa ʻē aʻe ma mua o nā papa luna a me lalo i ʻike ʻia ma nā papa ʻaoʻao ʻelua.Kūkulu ʻia nā PCB multilayer e ka laminating i nā papa like ʻole.Hoʻopaʻa pū ʻia nā papa-loko, nā papa kaapuni ʻaoʻao ʻelua, me nā ʻāpana insulating ma waena a ma waena o ke keleawe-foil no nā papa-waho.ʻO nā puka i wili ʻia ma ka papa (vias) e hoʻopili ai me nā papa like ʻole o ka papa.
ʻenehana & hiki
| 'ikamu | Kapa Hana Hana |
| Helu Lapa | 1-20 papa |
| Mea waiwai | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. |
| Mānoanoa papa | 0.10mm-8.00mm |
| Nui Nui | 600mmX1200mm |
| Papa Outline tolerance | +0.10mm |
| Mānoanoa hoʻomanawanui (t≥0.8mm) | ±8% |
| Mānoanoa hoʻomanawanui (t<0.8mm) | ± 10% |
| Mānoanoa Layer Insulation | 0.075mm--5.00mm |
| Laina liʻiliʻi | 0.075mm |
| Wahi liʻiliʻi | 0.075mm |
| Ka Manoanoa keleawe o waho | 18um--350um |
| Mānoanoa keleawe o loko | 17um--175um |
| Luwaha wili (Mechanical) | 0.15mm--6.35mm |
| Hole Hoʻopau (Mechanical) | 0.10mm-6.30mm |
| Ka hoʻomanawanui ʻana (Mechanical) | 0.05mm |
| Kakau inoa (Mechanical) | 0.075mm |
| ʻAspect Ratio | 16:1 |
| ʻAno Māka Solder | LPI |
| SMT Mini.Solder Mask Laulā | 0.075mm |
| Mini.Hoʻomaʻemaʻe Palekana Solder | 0.05mm |
| Anawaena Puka Puka | 0.25mm--0.60mm |
| Ka hoʻomalu impedance Ka hoʻomanawanui | ± 10% |
| Hoʻopau ʻili / lapaʻau | HASL, ENIG, Chem, Tin, Gula Flash, OSP, Manalima Gula |
Q/T Lead Time
| Māhele | Manawa alakai wikiwiki loa | Manawa alakai ma'amau |
| ʻaoʻao ʻelua | 24 hola | 120 hola |
| 4 Papahana | 48 hola | 172 hola |
| 6 Papahana | 72 hola | 192 hola |
| 8 Papahana | 96 hola | 212 hola |
| 10 Papa | 120 hola | 268 hola |
| 12 Papa | 120 hola | 280 hola |
| 14 Papahana | 144 hola | 292 hola |
| 16-20 Papa | Ma muli o nā koi kiko'ī | |
| Ma luna o 20 Layer | Ma muli o nā koi kiko'ī | |
ʻO ka neʻe ʻana o ABIS e hoʻomalu iā FR4 PCBS
Hoomakaukau Puka
Ke wehe pono nei i ka ʻōpala a me ka hoʻoponopono ʻana i nā ʻāpana mīkini drill: ma mua o ka hoʻopili ʻana me ke keleawe, nānā nui ʻo ABIS i nā puka āpau ma kahi FR4 PCB i mālama ʻia e wehe i nā ʻōpala, nā hewa ʻole o ka ʻili, a me ka epoxy smear, ʻo nā lua maʻemaʻe e hōʻoia i ka paʻa pono ʻana o ka plating i nā paia puka. .no hoi, i ka hoomaka ana o ke kaʻina hana, drill machine parameter ua hoʻoponopono pololei.
Hoʻomākaukau ʻili
Hoʻopau me ke akahele: e ʻike mua kā mākou poʻe ʻenehana loea ʻo ke ala wale nō e pale aku ai i kahi hopena maikaʻi ʻole ʻo ka manaʻo ʻana i ka pono o ka lawelawe kūikawā a me ka hana ʻana i nā hana kūpono e hōʻoia i ka hana pono a me ka pololei.
Uku Hoonui wela
Maʻa i ka hana ʻana i nā mea like ʻole, hiki iā ABIS ke kālailai i ka hui ʻana i mea e maopopo ai ua kūpono ia.a laila mālama i ka hilinaʻi lōʻihi o ka CTE (coefficient of thermal expansion), me ka CTE haʻahaʻa, ʻoi aku ka liʻiliʻi o ka pale ʻana i nā lua mai ka hoʻololi pinepine ʻana o ke keleawe e hoʻopili ai i nā pilina o loko.
Ka hoʻonui ʻana
Hoʻonui ʻia ka mana ʻo ABIS i ka circuitry e nā pākēneka i ʻike ʻia ma ka kali ʻana i kēia nalowale i hiki ai i nā papa ke hoʻi i ko lākou mau ana i hoʻolālā ʻia ma hope o ka pau ʻana o ka pōʻai lamination.no hoi, ka hoʻohana 'ana i ka baseline scaling paipai 'ana i ka hui 'ana me ka 'ikepili kaʻina hana helu i loko o ka hale, e dial-i nā kumu unahi e like me ka manawa i loko o ia wahi manufacturing.
Mīkini
Ke hiki mai ka manawa e kūkulu ai i kāu PCB, e hōʻoia ʻo ABIS e koho ʻoe i nā lako kūpono a me ka ʻike e hana pono ai i ka hoʻāʻo mua.
Hōʻike ʻia nā huahana a me nā lako PCB
PCB paʻa, PCB hikiwawe, PCB paʻa-paʻa, PCB HDI, Hui PCB
Misiona Pono ABIS
LIST lakohana holomua
| Hoao AOI | Nā ʻike no ka paʻi solderE nānā i nā ʻāpana a hiki i 0201 E nānā i nā ʻāpana nalo, offset, nā ʻāpana hewa, polarity |
| Nānā X-Ray | Hāʻawi ʻo X-Ray i ka nānā ʻana i ka hoʻonā kiʻekiʻe o: BGAs/Micro BGAs/Puʻupuʻu pālākiō Chip / Nā papa ʻole. |
| Hoao Kaapuni | Hoʻohana maʻamau ka hoʻāʻo ʻana i loko o ka pōʻai me AOI e hōʻemi ana i nā hemahema hana i hoʻokumu ʻia e nā pilikia ʻāpana. |
| Ho'āʻo mana | Ka Papahana Mea Hana Kiʻekiʻe TestFlash Hoao hana |
IOC ka nānā 'ana mai
SPI solder paste inspection
Nānā AOI pūnaewele
Nānā ʻatikala mua SMT
Loiloi waho
X-RAY-welding inspection
Hana hou ka mea hana BGA
Nānā QA
Anti-static warehousing a me ka hoʻouna
Pursue 0% hoʻopiʻi no ka maikaʻi
Pono nā 'oihana a pau e like me ka ISO a me ka 'oihana pili e ho'olako i ka hō'ike 8D inā i 'oki 'ia kekahi papa i ka hewa.
Pono nā papa i waho a pau e 100% hoʻāʻo uila, hoʻāʻo impedance a me ke kūʻai aku.
Nānā ʻia, hana mākou i ka microsection ma mua o ka hoʻouna ʻana.
E hoʻomaʻamaʻa i ka noʻonoʻo o nā limahana a me kā mākou moʻomeheu ʻoihana, e hauʻoli i kā lākou hana a me kā mākou hui, he mea kōkua iā lākou e hana i nā huahana maikaʻi.
ʻO nā mea waiwai kiʻekiʻe (Shengyi FR4, ITEQ, Taiyo Solder Mask Ink etc.)
Hiki i ka AOI ke nānā i ka pūʻulu holoʻokoʻa, nānā ʻia nā papa ma hope o kēlā me kēia kaʻina hana
Palapala
FAQ
No ka hōʻoia ʻana i kahi ʻōlelo kūpono, e hoʻokomo i kēia ʻike no kāu papahana:
E hoʻopiha i nā faila GERBER me ka papa inoa BOM
l Na nui
l manawa huli
l Nā koi o ka Panelization
l Nā mea e pono ai
l Hoʻopau i nā koi
l E hāʻawi ʻia kāu ʻōlelo maʻamau i nā hola 2-24 wale nō, ma muli o ka paʻakikī o ka hoʻolālā.
E loaʻa i kēlā me kēia mea kūʻai ke kūʻai aku iā ʻoe.Ko makou hola hana: AM 9:00-PM 19:00(Beijing Time) mai Poakahi a Poalima.E pane koke mākou i kāu leka uila i ko mākou manawa hana.A hiki iā ʻoe ke hoʻokaʻaʻike i kā mākou kūʻai aku ma ke kelepona inā wikiwiki.
ISO9001, ISO14001, UL USA & USA Kanada, IFA16949, SGS, RoHS hōʻike.
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini kikohoʻe metallo graghic
f), AOI (Nānā Optical Aunoa)
ʻAe, hauʻoli mākou i ka hāʻawi ʻana i nā laʻana modula e hoʻāʻo a nānā i ka maikaʻi, loaʻa nā ʻāpana hāpana hui.E ʻoluʻolu e uku ka mea kūʻai aku i ke kumukūʻai hoʻouna.
ʻOi aku ka nui o ka hāʻawi manawa ma mua o 95%
a), 24 hola huli wikiwiki no ka ʻaoʻao ʻelua prototype PCB
b), 48 hola no 4-8 papa prototype PCB
c), 1 hola no ka ʻōlelo ʻana
d), 2 hola no ka nīnau ʻenekinia/manaʻo hoʻopiʻi
e), 7-24 mau hola no ke kākoʻo ʻenehana / lawelawe kauoha / hana hana
ʻAʻole koho ʻo ABIS i nā kauoha.Hoʻokipa ʻia nā kauoha liʻiliʻi a me nā kauoha Mass a ʻo mākou ʻo ABIS e koʻikoʻi a kuleana, a lawelawe i nā mea kūʻai aku me ka maikaʻi a me ka nui.
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl e like me ka hoʻāʻo ʻana i ka uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
a), 1 Hola olelo
b), 2 hola o ka manaʻo hoʻopiʻi
c), 7*24 hola kākoʻo ʻenehana
d), 7*24 lawelawe kauoha
e), 7*24 hola hoʻouna
f), 7*24 holo hana
| Iecaianoaaiiuo hiki o wela-kūʻai huahana | |
| ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop | Hale Hana PCB Aluminum |
| Hiki i ka ʻenehana | Hiki i ka ʻenehana |
| Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON | Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe |
| Layer: 1 papa i 20 Layer | Layer: 1 papa a me 2 Layer |
| Min.line laula: 3mil/3mil(0.075mm/0.075mm) | Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole nui: 0.1mm (dirilling puka) | Min.Ka nui o ka puka: 12mil(0.3mm) |
| Max.Nui papa: 1200mm* 600mm | Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in) |
| Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm | Pau ka mānoanoa o ka papa: 0.3 ~ 5mm |
| Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) | Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz) |
| NPTH Hole Hoʻomanawanui: +/-0.075mm, PTH hole hoʻomanawanui: +/-0.05mm | Ka hoʻomanawanui kūlana puka: +/-0.05mm |
| Hoʻomanawanui Outline: +/-0.13mm | Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm |
| Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. | Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc |
| Ka hoʻomanawanui ʻana o ka Impedance: +/-10% | Noho ka mānoanoa hoʻomanawanui: +/-0.1mm |
| Hiki ke hana: 50,000 sqm / mahina | MC PCB Hiki i ka hana: 10,000 sqm / mahina |
