6 papa Paʻa gula PCB Papa me 3.2mm ka mānoanoa papa a me ka Counter Sink Hole
ʻIke kumu
| Hōʻike No. | PCB-A37 |
| Puke halihali | Hoʻopaʻa ʻumehana |
| Palapala hōʻoia | UL, ISO9001 & ISO14001, RoHS |
| Palapala noi | Mea uila uila |
| Wahi liʻiliʻi/Line | 0.075mm/3mil |
| Kapa Hana Hana | 50,000 sqm / mahina |
| HS Code | 853400900 |
| Ke kumu | Hana ʻia ma Kina |
Hōʻike huahana
HDI PCB Introduction
Ua wehewehe ʻia ʻo HDI PCB ma ke ʻano he papa kaapuni i paʻi ʻia me ka ʻoi aku ka nui o nā uwila ʻoi aku ka nui ma mua o kahi PCB maʻamau.Loaʻa iā lākou nā laina ʻoi aku ka maikaʻi a me nā hakahaka, nā vias liʻiliʻi a me nā pad hopu, a ʻoi aku ka kiʻekiʻe o ka pā pad pili ma mua o ka hana ma ka ʻenehana PCB maʻamau.Hana ʻia nā PCB HDI ma o nā microvias, kanu ʻia a me ka lamination sequential me nā mea insulation a me nā uea conductor no ke kiʻekiʻe kiʻekiʻe o ke ala.
Nā noi
Hoʻohana ʻia ʻo HDI PCB e hōʻemi i ka nui a me ke kaumaha, a me ka hoʻomaikaʻi ʻana i ka hana uila o ka hāmeʻa.ʻO HDI PCB ka koho maikaʻi loa i ka helu-papa kiʻekiʻe a me ka laminate maʻamau maʻamau a i ʻole nā papa laminated sequentially.Hoʻokomo ʻo HDI i nā vias makapō a kanu ʻia e kōkua i ka mālama ʻana i ka waiwai PCB ma o ka ʻae ʻana i nā hiʻohiʻona a me nā laina e hoʻolālā ʻia ma luna a ma lalo o lākou me ka ʻole o ka pilina.ʻAʻole ʻae ka hapa nui o ka BGA pitch maikaʻi i kēia lā a me nā kapuaʻi ʻāpana flip-chip no ka holo ʻana ma waena o nā pā BGA.ʻO nā makapō a kanu ʻia nā vias e hoʻopili wale i nā papa e koi ana i nā pilina ma kēlā wahi.
ʻenehana & hiki
| MEA | HIKI | MEA | HIKI |
| Nā ʻāpana | 1-20L | Ke keleawe mānoanoa | 1-6OZ |
| ʻAno Huahana | HF(Ke alapine kiʻekiʻe) & (Radio Frequency) papa, Imedance control board, HDIboard, BGA & Fine Pitch board | Palekana Solder | Nanya & Taiyo;LRI & Matt Red.ʻōmaʻomaʻo, melemele, keʻokeʻo, uliuli, ʻeleʻele |
| Mea kumu | FR4 (Shengyi Kina, ITEQ, KB A+, HZ), HITG, FrO6, Rogers, Taconic, Argon, Nalco lsola a pēlā aku | Ili Pau | HASL maʻamau, HASL Lead-free, FlashGold, ENIG (lmmersion Gula) OSP (Entek), lmmersion TiN, lmmersion Kālā, Paʻa gula |
| Lapaʻau ʻili koho | ENIG(Gula kaiapuni) + OSP ,ENIG(Gula kaiapuni) + Manamana gula, Manamana gula Flash, immersionSlive + Manamana Gula, Tin Kaiaulu + Manamana Gula | ||
| Hōʻike ʻenehana | Ka laulā laina liʻiliʻi loa: 3.5/4mil (laser dril) Ka nui o ka lua liʻiliʻi: 0.15 mm Ka liʻiliʻi loa o ke apo Annular: 4mil ʻO ka mānoanoa keleawe kiʻekiʻe: 6Oz Nui Nui Hana: 600x1200mm Mānoanoa o ka Papa: D/S: 0.2-70mm, Nā ʻāpana he nui: 0.40-7.Omm Min Solder Mask Bridge: ≥0.08mm Lakiō hiʻohiʻona: 15:1 Hiki ke hoʻopaʻa i ka vias: 0.2-0.8mm | ||
| Hoʻomanawanui | Hoʻomanawanui ʻia nā puka i uhi ʻia: ±0.08mm(min±0.05) Ka hoʻomanawanui ʻole o ka lua: ± O.05min(min+O/-005mm a i ʻole + 0.05/Omm) Hoʻomanawanui Outline: ± 0.15min(min±0.10mm) Ho'āʻo hana: Ke kū'ē kū'ē: 50 ohms (maʻamau) Peel off ikaika: 14N/mm Ho'āʻo Thermal Stress: 265C.20 kekona ʻO ka ʻoi aku ka paʻakikī: 6H E-ho'āʻo uila: 50ov±15/-0V 3os Warp and Twist: 0.7% (papa ho'āʻo semiconductor 0.3%) | ||
Nā hiʻohiʻona-ʻO kā mākou huahana pono
ʻOi aku ma mua o 15 mau makahiki ʻike i ka mea hana ma ke kahua lawelawe PCB
ʻO ka nui o ka hana ʻana e hōʻoia i ka haʻahaʻa o kāu kumukūʻai kūʻai.
ʻO ka laina hana kiʻekiʻe e hōʻoiaʻiʻo i ka maikaʻi paʻa a me ke ola lōʻihi
100% ho'āʻo no nā huahana PCB maʻamau
One-stop Service, hiki iā mākou ke kōkua i ke kūʻai ʻana i nā ʻāpana
Q/T Lead Time
| Māhele | Manawa alakai wikiwiki loa | Manawa alakai ma'amau |
| ʻaoʻao ʻelua | 24 hola | 120 hola |
| 4 Papahana | 48 hola | 172 hola |
| 6 Papahana | 72 hola | 192 hola |
| 8 Papahana | 96 hola | 212 hola |
| 10 Papa | 120 hola | 268 hola |
| 12 Papa | 120 hola | 280 hola |
| 14 Papahana | 144 hola | 292 hola |
| 16-20 Papa | Ma muli o nā koi kiko'ī | |
| Ma luna o 20 Layer | Ma muli o nā koi kiko'ī | |
ʻO ka neʻe ʻana o ABIS e kāohi iā FR4 PCBS
Hoomakaukau Puka
Ke wehe pono nei i ka ʻōpala a me ka hoʻoponopono ʻana i nā ʻāpana mīkini drill: ma mua o ka hoʻopili ʻana me ke keleawe, nānā nui ʻo ABIS i nā puka āpau ma kahi FR4 PCB i mālama ʻia e wehe i nā ʻōpala, nā hewa ʻole o ka ʻili, a me ka epoxy smear, ʻo nā lua maʻemaʻe e hōʻoia i ka paʻa pono ʻana o ka plating i nā paia puka. .no hoi, i ka hoomaka ana o ke kaʻina hana, drill machine parameter ua hoʻoponopono pololei.
Hoʻomākaukau ʻili
Hoʻopau me ke akahele: e ʻike mua kā mākou poʻe ʻenehana loea ʻo ke ala wale nō e pale aku ai i kahi hopena maikaʻi ʻole ʻo ka manaʻo ʻana i ka pono o ka lawelawe kūikawā a me ka hana ʻana i nā hana kūpono e hōʻoia i ka hana pono a me ka pololei.
Uku Hoonui wela
Maʻa i ka hana ʻana i nā mea like ʻole, hiki iā ABIS ke kālailai i ka hui ʻana i mea e maopopo ai ua kūpono ia.a laila mālama i ka hilinaʻi lōʻihi o ka CTE (coefficient of thermal expansion), me ka CTE haʻahaʻa, ʻoi aku ka liʻiliʻi o ka pale ʻana i nā lua mai ka hoʻololi pinepine ʻana o ke keleawe e hoʻopili ai i nā pilina o loko.
Ka hoʻonui ʻana
Hoʻonui ʻia ka mana ʻo ABIS i ka circuitry e nā pākēneka i ʻike ʻia ma ka kali ʻana i kēia nalowale i hiki ai i nā papa ke hoʻi i ko lākou mau ana i hoʻolālā ʻia ma hope o ka pau ʻana o ka pōʻai lamination.no hoi, ka hoʻohana 'ana i ka baseline scaling paipai 'ana i ka hui 'ana me ka 'ikepili kaʻina hana helu i loko o ka hale, e dial-i nā kumu unahi e like me ka manawa i loko o ia wahi manufacturing.
Mīkini
Ke hiki mai ka manawa e kūkulu ai i kāu PCB, e hōʻoia ʻo ABIS e koho ʻoe i nā lako kūpono a me ka ʻike e hana ai
Misiona Pono ABIS
ʻO ka helu o nā mea e hiki mai ana ma luna o 99.9%, ʻo ka helu o ka nui o ka hōʻole ʻana ma lalo o 0.01%.
Mālama nā ʻoihana i hōʻoia ʻia e ABIS i nā kaʻina hana nui e hoʻopau i nā pilikia āpau ma mua o ka hana ʻana.
Hoʻohana ʻo ABIS i nā polokalamu holomua e hana i ka loiloi DFM nui ma nā ʻikepili e hiki mai ana, a hoʻohana i nā ʻōnaehana hoʻokele maikaʻi i ka wā o ke kaʻina hana.
Hana ʻo ABIS i ka 100% nānā ʻike a me AOI a me ka hoʻokō ʻana i ka hoʻāʻo uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing and ionic cleanliness testing.
Palapala
FAQ
ʻO ka hapa nui o lākou mai Shengyi Technology Co., Ltd. (SYTECH), ʻo ia ka lua o ka mea hana CCL nui loa ma ka honua e pili ana i ka nui o ke kūʻai aku, mai 2013 a 2017. Ua hoʻokumu mākou i nā pilina lōʻihi o ka hui ʻana mai 2006. ʻO ka FR4 resin material (Model S1000-2, S1141, S1165, S1600) hoʻohana nui ʻia no ka hana ʻana i nā papa kaapuni paʻi hoʻokahi a me ʻelua ʻaoʻao a me nā papa ʻāpana-nui.Eia nā kikoʻī no kāu kuhikuhi.
No FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA
No CEM-1 & CEM 3: Sheng Yi, Papa Alii
No ke alapine kiʻekiʻe: Sheng Yi
No ka UV Cure: Tamura, Chang Xing ( * Loaʻa ke kala: ʻOmaomao) Solder no ka ʻaoʻao hoʻokahi
No ke kiʻi wai wai: Tao Yang, pale (kiʻiʻoniʻoni wet)
Chuan Yu ( * Loaʻa nā kala: Keʻokeʻo, Imaginable Solder Yellow, Purple, Red, Blue, Green, Black)
), 1 Hola olelo
b), 2 hola o ka manaʻo hoʻopiʻi
c), 7*24 hola kākoʻo ʻenehana
d), 7*24 lawelawe kauoha
e), 7*24 hola hoʻouna
f), 7*24 holo hana
ʻAʻole, ʻaʻole hiki iā mākou ke ʻae i nā faila kiʻi, inā ʻaʻohe ou faila Gerber, hiki iā ʻoe ke hoʻouna mai iā mākou i kahi laʻana e kope ai.
Kaʻina hana kope PCB&PCBA:
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini kikohoʻe metallo graghic
f), AOI (Nānā Optical Aunoa)
ʻOi aku ka nui o ka hāʻawi manawa ma mua o 95%
a), 24 hola huli wikiwiki no ka ʻaoʻao ʻelua prototype PCB
b), 48 hola no 4-8 papa prototype PCB
c), 1 hola no ka helu ʻana
d), 2 hola no ka nīnau ʻenekinia/manaʻo hoʻopiʻi
e), 7-24 mau hola no ke kākoʻo ʻenehana / lawelawe kauoha / hana hana
ʻAʻohe koi MOQ no ABIS no PCB a i ʻole PCBA.
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl e like me ka hoʻāʻo ʻana i ka uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
Nā ʻOihana Nui o ABIS: Ka Mana Hana, Telecommunication, Automotive Products and Medical.ʻO ka Mākeke Nui o ABIS: 90% International Market(40% -50% no USA, 35% no ʻEulopa, 5% no Rūsia a me 5% -10% no Asia Hikina) a me 10% Market Domestic.
| Iecaianoaaiiuo hiki o wela-kūʻai huahana | |
| ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop | Hale Hana PCB Aluminum |
| Hiki i ka ʻenehana | Hiki i ka ʻenehana |
| Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON | Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe |
| Layer: 1 papa i 20 Layer | Layer: 1 papa a me 2 Layer |
| Min.line laula: 3mil/3mil(0.075mm/0.075mm) | Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole nui: 0.1mm (dirilling puka) | Min.Ka nui o ka puka: 12mil(0.3mm) |
| Max.Nui papa: 1200mm* 600mm | Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in) |
| Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm | Pau ka mānoanoa o ka papa: 0.3 ~ 5mm |
| Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) | Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz) |
| NPTH Hole Hoʻomanawanui: +/-0.075mm, PTH hole hoʻomanawanui: +/-0.05mm | Ka hoʻomanawanui kūlana puka: +/-0.05mm |
| Hoʻomanawanui Outline: +/-0.13mm | Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm |
| Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. | Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc |
| Ka hoʻomanawanui ʻana o ka Impedance: +/-10% | Noho ka mānoanoa hoʻomanawanui: +/-0.1mm |
| Hiki ke hana: 50,000 sqm / mahina | MC PCB Hiki i ka hana: 10,000 sqm / mahina |
