Hoʻopilikino ʻia ʻo Copper Substrate PCB High-frequency Circuit Board no ka ʻoihana Telecom me ke keleawe mānoanoa
Hōʻike huahana
Papa Kaapuni PCB me UL, SGS, ISO palapala
- Hoʻokahi, ʻaoʻao ʻelua a me ka PCB multi-layer
- Kanu/makapo Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole
- HASL me ke alakaʻi ʻole, Kaiapuni Gula/ Kālā/Tina, OSP, Pale gula/manamana, Peelable mask
- Hoʻopili nā Papa Kaapuni Paʻi i ka IPC Class 2 & 3 maʻamau PCB honua
- Loaʻa ka nui mai ka prototype a hiki i ka hana nui a me ka nui
- 100% E-Ho'āʻo
ʻenehana & hiki
| MEA | HIKI | MEA | HIKI |
| Nā ʻāpana | 1-20L | Ke keleawe mānoanoa | 1-6OZ |
| ʻAno Huahana | HF(Ke alapine kiʻekiʻe) & (Radio Frequency) papa, Imedance control board, HDIboard, BGA & Fine Pitch board | Palekana Solder | Nanya & Taiyo;LRI & Matt Red.ʻōmaʻomaʻo, melemele, keʻokeʻo, uliuli, ʻeleʻele |
| Mea kumu | FR4 (Shengyi Kina, ITEQ, KB A+, HZ), HITG, FrO6, Rogers, Taconic, Argon, Nalco lsola a pēlā aku | Ili Pau | HASL maʻamau, HASL Lead-free, FlashGold, ENIG (lmmersion Gula) OSP (Entek), lmmersion TiN, lmmersion Kālā, Paʻa gula |
| Lapaʻau ʻili koho | ENIG(Gula kaiapuni) + OSP ,ENIG(Gula kaiapuni) + Manamana gula, Manamana gula Flash, immersionSlive + Manamana Gula, Tin Kaiaulu + Manamana Gula | ||
| Hōʻike ʻenehana | Ka laulā laina liʻiliʻi loa: 3.5/4mil (laser dril) Ka nui o ka lua liʻiliʻi: 0.15 mm Ka liʻiliʻi loa o ke apo Annular: 4mil ʻO ka mānoanoa keleawe kiʻekiʻe: 6Oz Nui Nui Hana: 600x1200mm Mānoanoa o ka Papa: D/S: 0.2-70mm, Nā ʻāpana he nui: 0.40-7.Omm Min Solder Mask Bridge: ≥0.08mm Lakiō hiʻohiʻona: 15:1 Hiki ke hoʻopaʻa i ka vias: 0.2-0.8mm | ||
| Hoʻomanawanui | Hoʻomanawanui ʻia nā puka i uhi ʻia: ±0.08mm(min±0.05) Ka hoʻomanawanui ʻole o ka lua: ± O.05min(min+O/-005mm a i ʻole + 0.05/Omm) Hoʻomanawanui Outline: ± 0.15min(min±0.10mm) Ho'āʻo hana: Ke kū'ē kū'ē: 50 ohms (maʻamau) Peel off ikaika: 14N/mm Ho'āʻo Thermal Stress: 265C.20 kekona ʻO ka ʻoi aku ka paʻakikī: 6H E-ho'āʻo uila: 50ov±15/-0V 3os Warp and Twist: 0.7% (papa ho'āʻo semiconductor 0.3%) | ||
ʻO ka moʻolelo o ka hui
ABIS Circuits Co., Ltdi hoʻokumu ʻia i ka makahiki 2006, Aia ma Shenzhen, aia kā mākou hui ma kahi o 1100 mau limahana a me ʻelua mau papa hana PCB me kahi 50000 square meters.
Hoʻohana nui ʻia kā mākou huahana ma ke kahua o ka Mana Mana, Telecommunication, Automotive Products, Medical, Consumer, Security a me nā mea ʻē aʻe.
ʻO kā mākou hoʻokele maikaʻi loa, nā mea hana kiʻekiʻe, a me nā limahana ʻoihana nā kī no mākou e hakakā ai no ka lanakila ʻana i nā māhele mākeke me nā mea hoʻokūkū ʻē aʻe.
I kēia manawa ua hala mākou i lSO9001, ISO14001, UL, a me nā mea ʻē aʻe, Me ka hana paʻa mau o kā mākou limahana a me ke kākoʻo mau ʻana mai nā mea kūʻai aku ma ka home a ma waho, hiki iā mākou ke hāʻawi i nā papa 20, Blind and buried Board, high-precision (Rogers), ʻO TG kiʻekiʻe, Alu-base a me nā papa maʻalahi i kā mākou mea kūʻai aku me ka wikiwiki wikiwiki a me ka pae kiʻekiʻe.
lawelawe hoʻokahi.
Kaʻina hana PCB
Q/T Lead Time
| Māhele | Manawa alakai wikiwiki loa | Manawa alakai ma'amau |
| ʻaoʻao ʻelua | 24 hola | 120 hola |
| 4 Papahana | 48 hola | 172 hola |
| 6 Papahana | 72 hola | 192 hola |
| 8 Papahana | 96 hola | 212 hola |
| 10 Papa | 120 hola | 268 hola |
| 12 Papa | 120 hola | 280 hola |
| 14 Papahana | 144 hola | 292 hola |
| 16-20 Papa | Ma muli o nā koi kiko'ī | |
| Ma luna o 20 Layer | Ma muli o nā koi kiko'ī | |
ʻO ka neʻe ʻana o ABIS e hoʻomalu iā FR4 PCBS
- Hoomakaukau Puka
Ke wehe pono nei i ka ʻōpala a me ka hoʻoponopono ʻana i nā ʻāpana mīkini drill: ma mua o ka hoʻopili ʻana me ke keleawe, nānā nui ʻo ABIS i nā puka āpau ma kahi FR4 PCB i mālama ʻia e wehe i nā ʻōpala, nā hewa ʻole o ka ʻili, a me ka epoxy smear, ʻo nā lua maʻemaʻe e hōʻoia i ka paʻa pono ʻana o ka plating i nā paia puka. .no hoi, i ka hoomaka ana o ke kaʻina hana, drill machine parameter ua hoʻoponopono pololei.
- Hoʻomākaukau ʻili
Hoʻopau me ke akahele: e ʻike mua kā mākou poʻe ʻenehana loea ʻo ke ala wale nō e pale aku ai i kahi hopena maikaʻi ʻole ʻo ka manaʻo ʻana i ka pono o ka lawelawe kūikawā a me ka hana ʻana i nā hana kūpono e hōʻoia i ka hana pono a me ka pololei.
- Uku Hoonui wela
Maʻa i ka hana ʻana i nā mea like ʻole, hiki iā ABIS ke kālailai i ka hui ʻana i mea e maopopo ai ua kūpono ia.a laila mālama i ka hilinaʻi lōʻihi o ka CTE (coefficient of thermal expansion), me ka CTE haʻahaʻa, ʻoi aku ka liʻiliʻi o ka pale ʻana i nā lua mai ka hoʻololi pinepine ʻana o ke keleawe e hoʻopili ai i nā pilina o loko.
- Ka hoʻonui ʻana
Hoʻonui ʻia ka mana ʻo ABIS i ka circuitry e nā pākēneka i ʻike ʻia ma ka kali ʻana i kēia nalowale i hiki ai i nā papa ke hoʻi i ko lākou mau ana i hoʻolālā ʻia ma hope o ka pau ʻana o ka pōʻai lamination.no hoi, ka hoʻohana 'ana i ka baseline scaling paipai 'ana i ka hui 'ana me ka 'ikepili kaʻina hana helu i loko o ka hale, e dial-i nā kumu unahi e like me ka manawa i loko o ia wahi manufacturing.
- Mīkini
Ke hiki mai ka manawa e kūkulu ai i kāu PCB, e hōʻoia ʻo ABIS e koho ʻoe i nā lako kūpono a me ka ʻike e hana pono ai i ka hoʻāʻo mua.
Nā hiʻohiʻona-ʻO kā mākou huahana pono
- Ma luna o 15makahiki ʻike i ka mea hana ma PCB lawelawe kahua
- ʻO ka nui o ka hana ʻana e hōʻoia i ka haʻahaʻa o kāu kumukūʻai kūʻai.
- ʻO ka laina hana kiʻekiʻe e hōʻoiaʻiʻo i ka maikaʻi paʻa a me ke ola lōʻihi
- 100% ho'āʻo no nā mea a pau i hoʻopilikino ʻiaPCBhuahana
- One-stop Service, hiki iā mākou ke kōkua e kūʻai i kaʻāpana
Misiona Pono ABIS
- ʻO ka helu o nā mea e hiki mai ana ma luna o 99.9%, ʻo ka helu o ka nui o ka hōʻole ʻana ma lalo o 0.01%.
- Mālama nā ʻoihana i hōʻoia ʻia e ABIS i nā kaʻina hana nui e hoʻopau i nā pilikia āpau ma mua o ka hana ʻana.
- Hoʻohana ʻo ABIS i nā polokalamu holomua e hana i ka loiloi DFM nui ma nā ʻikepili e hiki mai ana, a hoʻohana i nā ʻōnaehana hoʻokele maikaʻi i ka wā o ke kaʻina hana.
- Hana ʻo ABIS i ka 100% nānā ʻike a me AOI a me ka hoʻokō ʻana i ka hoʻāʻo uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing and ionic cleanliness testing.
Palapala
Ma mua o ke kūʻai aku a me ka lawelawe ma hope o ke kūʻai aku ʻana i ka hola 1
2 hola o ka hoʻopiʻi manaʻo
7 * 24 hola kākoʻo ʻenehana
7*24 kauoha lawelawe
7*24 hola lawe
7*24 holo hana
ʻŌlelo Pāʻoihana
-ʻAe ʻia nā ʻōlelo hoʻouna
FOB, CIF, EXW, FCA, CPT, DDP, DDU, Hoʻouna Hōʻike, DAF
--ʻAe ʻia ke kālā uku
USD, EUR, CNY.
-ʻAno uku i ʻae ʻia
T/T, PayPal, Western Union.
Puke a me ka lawe ʻana
ʻAʻole hoʻāʻo wale ʻo ABIS CIRCUITS Company e hāʻawi i nā mea kūʻai aku i kahi huahana maikaʻi, akā e hoʻolohe pū i ka hāʻawi ʻana i kahi pūʻolo piha a palekana.Eia kekahi, hoʻomākaukau mākou i kekahi mau lawelawe pilikino no nā kauoha āpau.
-Paʻi maʻamau:
- PCB: ʻeke i hoʻopaʻa ʻia, ʻeke Anti-static, pahu pahu kūpono.
- PCBA: ʻeke ʻeke antistatic, ʻeke anti-static, pahu pahu kūpono.
- Hoʻopilikino ʻia: E paʻi ʻia ka pahu pahu ma waho i ka inoa o ka helu o ka mea kūʻai aku, hōʻailona, pono ka mea kūʻai aku e kuhikuhi i ka huakaʻi a me nā ʻike ʻē aʻe.
- Manaʻo hoʻouna:
- No ka pūʻolo liʻiliʻi, ʻōlelo mākou e koho ma Express a i ʻole DDU lawelawe ʻo ia ke ala wikiwiki loa.
- No ka pūʻolo kaumaha, ʻo ka hopena maikaʻi loa ma ke kaʻa kai.
No ke aha e koho ai iā mākou
- ʻO nā mīkini koho kiʻekiʻe-kiʻekiʻe euipment-kiʻekiʻe e hiki ke hana ma kahi o 25,000 mau mea SMD i kēlā me kēia hola
- Hiki ke hoʻolako maikaʻi loa 60K Sqm i kēlā me kēia mahina-Ke hāʻawi nei i ka haʻahaʻa haʻahaʻa a me ka noi PCB hana, a me ka hana nui.
- 'Oihana 'enekinia hui-40 'enekinia a me ko lakou hale ponoi, ikaika ma OEM.Hāʻawi i nā koho maʻalahi ʻelua: ʻike Kuʻuna a me ka ʻike hohonu o ka IPC Class II a me III Standards
Hāʻawi mākou i kahi lawelawe EMS hulina piha i nā mea kūʻai aku e makemake iā mākou e hōʻuluʻulu i ka PCB i PCBA, me nā prototypes, papahana NPI, liʻiliʻi a me ka leo liʻiliʻi.Hiki iā mākou ke hoʻopuka i nā mea āpau no kāu papahana hui PCB.Loaʻa i kā mākou poʻe ʻenekinia a me kā mākou hui sourcing ka ʻike waiwai i ke kaulahao lako a me ka ʻoihana EMS, me ka ʻike hohonu i ka hui SMT e hiki ai ke hoʻoholo i nā pilikia hana āpau.ʻO kā mākou lawelawe he kumu kūʻai, maʻalahi, a hilinaʻi.Ua ʻoluʻolu mākou i nā mea kūʻai aku ma nā ʻoihana he nui e pili ana i ka lāʻau lapaʻau, ʻoihana, automotive a me nā mea hoʻohana uila.
E ʻoluʻolu e hoʻomaopopo iā mākou i kekahi hoihoi!
Manaʻo ʻo ABIS i kēlā me kēia kauoha a ʻo 1 ʻāpana!
ʻO ka hapa nui o lākou mai Shengyi Technology Co., Ltd. (SYTECH), ʻo ia ka lua o ka mea hana CCL nui loa ma ka honua e pili ana i ka nui o ke kūʻai aku, mai 2013 a 2017. Ua hoʻokumu mākou i nā pilina lōʻihi o ka hui ʻana mai 2006. ʻO ka FR4 resin material (Model S1000-2, S1141, S1165, S1600) hoʻohana nui ʻia no ka hana ʻana i nā papa kaapuni paʻi hoʻokahi a me ʻelua ʻaoʻao a me nā papa ʻāpana-nui.Eia nā kikoʻī no kāu kuhikuhi.
- No FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA
- No CEM-1 & CEM 3: Sheng Yi, Papa Alii
- No ke alapine kiʻekiʻe: Sheng Yi
- No ka UV Cure: Tamura, Chang Xing ( * Loaʻa ke kala: ʻOmaomao) Solder no ka ʻaoʻao hoʻokahi
- No ke kiʻi wai wai: Tao Yang, pale (kiʻiʻoniʻoni wet)
- Chuan Yu ( * Loaʻa nā kala: Keʻokeʻo, Imaginable Solder Yellow, Purple, Red, Blue, Green, Black)
E loaʻa i kēlā me kēia mea kūʻai ke kūʻai aku iā ʻoe.Ko makou hola hana: AM 9:00-PM 19:00(Beijing Time) mai Poakahi a Poalima.E pane koke mākou i kāu leka uila i ko mākou manawa hana.A hiki iā ʻoe ke hoʻokaʻaʻike i kā mākou kūʻai aku ma ke kelepona inā wikiwiki.
ʻAʻole, ʻaʻole hiki iā mākou ke ʻae i nā faila kiʻi, inā ʻaʻohe ou faila Gerber, hiki iā ʻoe ke hoʻouna mai iā mākou i kahi laʻana e kope ai.
E nānā a puni ʻoe.No laila, nui nā huahana mai Kina.ʻIke loa, he mau kumu kēia.ʻAʻole ia e pili ana i ke kumukūʻai.
- Hoʻomākaukau koke ʻia nā huaʻōlelo.
- Hoʻopau koke ʻia nā kauoha hana.Hiki iā ʻoe ke hoʻolālā i nā kauoha i hoʻonohonoho ʻia no nā mahina ma mua, hiki iā mākou ke hoʻonohonoho koke iā lākou ke hōʻoia ʻia ʻo PO.
- Ua hoʻonui nui ʻia ke kaulahao lako.ʻO ia ke kumu hiki iā mākou ke kūʻai i kēlā me kēia ʻāpana mai kahi hoa hana kūikawā me ka wikiwiki.
- ʻO nā limahana maʻalahi a makemake.ʻO ka hopena, ʻae mākou i kēlā me kēia kauoha.
- 24 lawelawe pūnaewele no nā pono koʻikoʻi.Nā hola hana o +10 hola i ka lā.
- Nā koina haʻahaʻa.ʻAʻohe kumukūʻai huna.Mālama i nā limahana, luna a me ka logistic.
Nānā i loko o 12 hola.Ke nānā ʻia ka nīnau a Engineer a me ka faila hana, e hoʻomaka mākou i ka hana.
ʻO kā mākou mau kaʻina hana hōʻoia maikaʻi e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoʻomalu impedance
d), ʻIke hiki ke kūʻai
e), ʻenekini ʻeleʻele metallograghic
f), AOI (Nānā Optical Aunoa)
ʻAʻohe koi MOQ no ABIS no PCB a i ʻole PCBA.
Hana ʻo ABlS i ka 100% nānā ʻike a me AOl e like me ka hoʻāʻo ʻana i ka uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedance control, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
| Iecaianoaaiiuo hiki o wela-kūʻai huahana | |
| ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop | Hale Hana PCB Aluminum |
| Hiki i ka ʻenehana | Hiki i ka ʻenehana |
| Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON | Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe |
| Layer: 1 papa i 20 Layer | Layer: 1 papa a me 2 Layer |
| Min.line laula: 3mil/3mil(0.075mm/0.075mm) | Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole nui: 0.1mm (dirilling puka) | Min.Ka nui o ka puka: 12mil(0.3mm) |
| Max.Nui papa: 1200mm* 600mm | Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in) |
| Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm | Pau ka mānoanoa o ka papa: 0.3 ~ 5mm |
| Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) | Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz) |
| NPTH Hole Hoʻomanawanui: +/-0.075mm,PTH hole hoʻomanawanui: +/-0.05mm | Ka hoʻomanawanui kūlana puka: +/-0.05mm |
| Hoʻomanawanui Outline: +/-0.13mm | Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm |
| Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. | Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc |
| Ka hoʻomanawanui ʻana o ka Impedance: +/-10% | Noho ka mānoanoa hoʻomanawanui: +/-0.1mm |
| Hiki ke hana: 50,000 sqm / mahina | MC PCB Hiki i ka hana: 10,000 sqm / mahina |
