ʻO nā ʻĀpana Hui Pū ʻIa Hana piha ʻO ka papa PCBA no nā uila uila

ʻO ka wehewehe pōkole:

ʻIke Kumu No.: PCB-A43, e hoʻolauna ana i kā mākou lawelawe piha pihaHui PCB hoʻonāi hoʻolālā ʻia noʻoihana uila.ʻO kēia2-papa PCBA papakaena kiʻekiʻeFR4 meame amānoanoa o 1.5mma he ake kaumaha keleawe o 1.5oz.Hana maikaʻi ʻia ka hoʻopau ʻana me ka hoʻohana ʻana i kaHASLkaʻina hana, e hōʻoia ana i ka conductivity a me ka hilinaʻi.Mai ka manaʻo a hiki i ka hoʻopau ʻana, hōʻoia kā mākou hui loea i ka hoʻohui pono ʻana a me ka hui pololei ʻana, e hālāwai ana i nā kūlana ʻoihana koi nui.E hookiekie i kouʻenehana uila ʻenehaname kā mākou hopena PCBA ʻokiʻoki no ka hana hilinaʻi a me ka hana kiʻekiʻe.E hilinaʻi iā mākou no kāu papahana uila aʻe aʻike i ka maikaʻima kela a me keia ano.


  • KULA NO.:PCB-A43
  • Papahana: 2L
  • Anana:151.7mm*74.7mm
  • Mea Kumu:FR4
  • Mānoanoa Papa:1.5mm
  • Mea hoʻonani i luna:HASL
  • Mānoanoa keleawe:1.5oz
  • Ka waihoʻoluʻu huna huna:ʻōmaʻomaʻo
  • Huahana Huahana

    Huahana Huahana

    ʻIke hana

    Hōʻike No. PCB-A43
    ʻano hui SMT
    Puke halihali ʻAi-static Packaging
    Palapala hōʻoia UL, ISO9001&14001, SGS, RoHS, Ts16949
    Wehewehe IPC Papa2
    Wahi liʻiliʻi/Line 0.075mm/3mil
    Palapala noi Kūkākūkā
    Ke kumu Hana ʻia ma Kina
    Kapa Hana Hana 720,000 M2 / Makahiki

    Hōʻike huahana

    PCB ʻoʻoleʻa, PCB hikiwawe, PCB ʻoʻoleʻa-Flex, HDI PCB, PCB Hui-1

    Hoʻolauna ʻia nā papahana PCBA

    Hāʻawi ʻo ABIS CIRCUITS Company i nā lawelawe, ʻaʻole nā ​​huahana wale nō.Hāʻawi mākou i nā hāʻina, ʻaʻole wale i nā waiwai.

    Mai ka hana ʻana o ka PCB, ʻo nā mea kūʻai aku i nā ʻāpana e ʻākoakoa.Aia pū me:

    PCB Kuʻuna

    Kiʻi / hoʻolālā PCB e like me kāu kiʻi schematic

    hana PCB

    Hoʻopili mea hoʻohui

    Huipuia PCB

    PCBA 100% hoao

    PCBA hiki

    1 ʻO ka hui SMT me ka hui BGA
    2 Nā ʻāpana SMD i ʻae ʻia: 0204, BGA, QFP, QFN, TSOP
    3 Kiʻekiʻe o ka mea: 0.2-25mm
    4 ʻO ka pahu liʻiliʻi: 0204
    5 Min mamao ma waena o BGA: 0.25-2.0mm
    6 Min BGA nui: 0.1-0.63mm
    7 Min QFP wahi: 0.35mm
    8 Ka nui hui min: (X*Y): 50*30mm
    9 Ka nui hui nui: (X*Y): 350*550mm
    10 ʻO ka pololei koho koho: ± 0.01mm
    11 Hiki ke hoʻokomo: 0805, 0603, 0402
    12 Loaʻa ke kūpono paʻi helu pine kiʻekiʻe
    13 Ka mana SMT i kēlā me kēia lā: 80,000 mau helu

    Hiki - SMT

    Laina

    9(5 Yamaha,4KME)

    Ka hiki

    52 miliona mau wahi i kēlā me kēia mahina

    Nui Papa Nui

    457*356mm.(18”X14”)

    Min Nui o ka mea

    0201-54 sq.mm.(0.084 sq.inch), hoʻohui lōʻihi, CSP,BGA,QFP

    Ka māmā holo

    0.15 sec/chip,0.7 sec/QFP

    Hiki - PTH

    Laina

    2

    Ka laula o ka papa

    400 mm

    ʻAno

    ʻAle pālua

    Kūlana Pbs

    Kākoʻo laina alakaʻi ʻole

    ʻO ka mahana kiʻekiʻe

    399 degere C

    Kapu ʻana

    mea hoʻohui

    Wela mua

    3

    He aha ka DIP

    pūʻolo inline-pin ʻelua, E pili ana i nā ʻāpana kaapuni i hoʻopili ʻia ma ke ʻano ʻelua-in-line.Hoʻohana ka hapa nui o nā pōʻai liʻiliʻi a me waena i kēia pūʻolo.

    ʻO kā mākou DIP Line

    5 DIP Līina Kūʻai Lima
    Loaʻa iā ABIS 5 DIP Hand Soldering Line e hoʻopau maikaʻi i nā papahana no kā mākou mea kūʻai.

    Ke kuleana o ka ʻenehana hana
    E nānā kā mākou mau ʻenekini i nā kūlana ma ka laina hana a hāʻawi i kahi manaʻo o ka pilikia.

    Ka Mana Mana

    Hoʻokomo i ka mana maikaʻi
    Hoao AOI Nā ʻike no ka paʻi solderE nānā i nā ʻāpana a hiki i 0201

    E nānā i nā ʻāpana nalo, offset, nā ʻāpana hewa, polarity

    Nānā X-Ray Hāʻawi ʻo X-Ray i ka nānā ʻana i ka hoʻonā kiʻekiʻe o: BGAs/Micro BGAs/Puʻupuʻu pālākiō Chip / Nā papa ʻole.
    Hoao Kaapuni Hoʻohana maʻamau ka hoʻāʻo ʻana i loko o ka pōʻai me AOI e hōʻemi ana i nā hemahema hana i hoʻokumu ʻia e nā pilikia ʻāpana.
    Ho'āʻo mana Ka Papahana Mea Hana Kiʻekiʻe TestFlash

    Hoao hana

    Palapala

    palapala hōʻoia2 (1)
    palapala hōʻoia2 (2)
    palapala hōʻoia2 (4)
    palapala hōʻoia2 (3)

    FAQ

    Q1: Hiki iā ʻoe ke hana i kaʻu mau PCB mai kahi faila kiʻi?

    ʻAʻole, ʻaʻole hiki iā mākou ke ʻae i nā faila kiʻi, inā ʻaʻohe āu faila gerber, hiki iā ʻoe ke hoʻouna mai iā mākou i kahi laʻana e kope iā ia.

    Kaʻina hana kope PCB&PCBA

    Hiki iā ʻoe ke hana i kaʻu mau PCB mai kahi faila kiʻi01

    Q2: Hiki i nā PCB ke ʻākoakoa ma ka lima?

    ʻAe, hiki ke hōʻuluʻulu ʻia nā PCB ma ka lima, akā he hana hoʻopau manawa a hewa.ʻO ka hui ʻokoʻa me ka hoʻohana ʻana i nā mīkini koho-a-wahi ke ala i makemake ʻia no ka hapa nui o nā PCB.

    Q3: He aha ka ʻokoʻa ma waena o PCB a me PCBA?

    ʻO ka PCB kahi papa me nā ala keleawe a me nā pale e hoʻopili ai i nā mea uila.ʻO ka PCBA e pili ana i ka hui ʻana o nā ʻāpana ma luna o kahi PCB e hana i kahi mea uila e hana nei.

    Q4: He aha ke kumu o ka solder paste ma PCBA?

    SHoʻohana ʻia ka paʻi kahiko e hoʻopaʻa i nā mea uila i kahi manawa ma mua o ka hoʻopili mau ʻana i ka PCB i ka wā o ke kaʻina hana reflow.

    Q5: He aha nā mea i hiki ke hana i nā huahana kūʻai wela?
    Iecaianoaaiiuo hiki o wela-kūʻai huahana
    ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop Hale Hana PCB Aluminum
    Hiki i ka ʻenehana Hiki i ka ʻenehana
    Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe
    Layer: 1 papa i 20 Layer Layer: 1 papa a me 2 Layer
    Min.line laula: 3mil/3mil(0.075mm/0.075mm) Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm)
    Min.Hole nui: 0.1mm (dirilling puka) Min.Ka nui o ka puka: 12mil(0.3mm)
    Max.Nui papa: 1200mm* 600mm Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in)
    Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm Pau ka mānoanoa o ka papa: 0.3 ~ 5mm
    Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz)
    NPTH Hole Hoʻomanawanui: +/-0.075mm, PTH hole hoʻomanawanui: +/-0.05mm Ka hoʻomanawanui kūlana puka: +/-0.05mm
    Hoʻomanawanui Outline: +/-0.13mm Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm
    Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc
    Ka hoʻomanawanui ʻana o ka Impedance: +/-10% Noho ka mānoanoa hoʻomanawanui: +/-0.1mm
    Hiki ke hana: 50,000 sqm / mahina MC PCB Hiki i ka hana: 10,000 sqm / mahina
    Q6: Peheaʻoe e ho'āʻo ai a mālama i ka maikaʻi?

    ʻO kā mākou mau kaʻina hana hōʻoia e like me lalo:

    a), Nānā Kiʻi

    b), ʻImi lele, mea paahana

    c), Ka hoomalu impedance

    d), ʻike hiki ke kūʻai

    e), ʻeleu ʻeleʻele metallograghic kikohoʻe

    f),AOI(Nānā Optical Automated)

    Q7: He aha kāu e koi ai i mea e hana ai i kahi hōʻuluʻulu hui?

    Pili o nā mea waiwai (BOM) kikoʻī:

    a),Mnā helu o nā mea hana,

    b),Chelu ʻāpana o nā mea hoʻolako (eg Digi-key, Mouser, RS )

    c), PCBA laʻana kiʻi inā hiki.

    d), Ka nui

    Q8: Loaʻa iā ʻoe ka MOQ o nā huahana?Inā ʻae, he aha ka liʻiliʻi liʻiliʻi?

    ʻAʻohe koi MOQ no ABIS no PCB a i ʻole PCBA.

    Q9: He aha nā ʻano hoʻāʻo i loaʻa iā ʻoe?

    Hana ʻo ABlS i ka 100% nānā ʻike a me AOl a me ka hoʻokō ʻana i ka hoʻāʻo uila, ka hoʻāʻo uila kiʻekiʻe, ka hoʻāʻo ʻana i ka impedancecontrol, ka micro-sectioning, ka hoʻāʻo ʻana i ka wela, ka hoʻāʻo solder, ka hoʻāʻo ʻana i ka hilinaʻi, ka hoʻāʻo ʻana i ka pale ʻana., hoʻomaʻemaʻe ionica me ka hoʻāʻo ʻana o ka PCBA.

    Q10: No ke aha e koho ai iā mākou?

    · Me ABIS, hoʻemi nui nā mea kūʻai aku i kā lākou kumukūʻai kūʻai honua.Ma hope o kēlā me kēia lawelawe i hāʻawi ʻia e ABIS, ua hūnā ʻia kahi mālama kālā no nā mea kūʻai aku.

    .Loaʻa iā mākou ʻelua mau hale kūʻai, hoʻokahi no prototype, huli wikiwiki, a me ka hana liʻiliʻi.ʻO ka mea ʻē aʻe no ka hana nui no ka papa HDI, me nā limahana ʻoihana akamai loa, no nā huahana kiʻekiʻe me nā kumukūʻai hoʻokūkū a me ka lawe ʻana i ka manawa.

    .Hāʻawi mākou i ke kūʻai aku ʻoihana, kākoʻo loea a me ka logistic, ma ke ao holoʻokoʻa me 24 mau hola o ka manaʻo hoʻopiʻi.


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