ʻO ka hoʻohana ʻana i ka ʻike pūnaewele ʻo PCB board Controller PCBA Board no ka ʻoihana Telecommunication
ʻIke hana
Hōʻike No. | PCB-A44 |
ʻano hui | SMT |
Puke halihali | ʻAi-static Packaging |
Palapala hōʻoia | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
Wehewehe | IPC Papa2 |
Wahi liʻiliʻi/Line | 0.075mm/3mil |
Palapala noi | Kūkākūkā |
Ke kumu | Hana ʻia ma Kina |
Kapa Hana Hana | 720,000 M2 / Makahiki |
Hōʻike huahana
Hoʻolauna ʻia nā papahana PCBA
Hāʻawi ʻo ABIS CIRCUITS Company i nā lawelawe, ʻaʻole nā huahana wale nō.Hāʻawi mākou i nā hāʻina, ʻaʻole wale i nā waiwai.
Mai ka hana ʻana o ka PCB, ʻo nā mea kūʻai aku i nā ʻāpana e ʻākoakoa.Aia pū me:
- PCB Kuʻuna
- Kiʻi / hoʻolālā PCB e like me kāu kiʻi schematic
- hana PCB
- Hoʻopili mea hoʻohui
- Huipuia PCB
- PCBA 100% hoao
ʻO kā mākou pono
- ʻO nā mīkini koho kiʻekiʻe-kiʻekiʻe euipment-kiʻekiʻe e hiki ke hana ma kahi o 25,000 mau mea SMD i kēlā me kēia hola
- Hiki ke hoʻolako maikaʻi loa 60K Sqm i kēlā me kēia mahina-Ke hāʻawi nei i ka haʻahaʻa haʻahaʻa a me ka noi PCB hana, a me nā huahana nui.
- 'Oihana 'enekinia hui-40 'enekinia a me ko lakou hale ponoi, ikaika ma OEM.Hāʻawi i nā koho maʻalahi ʻelua: ʻike Kuʻuna a me ka ʻike hohonu o ka IPC Class II a me III Standards
Hāʻawi mākou i kahi lawelawe EMS hulina piha i nā mea kūʻai aku e makemake iā mākou e hōʻuluʻulu i ka PCB i PCBA, me nā prototypes, papahana NPI, liʻiliʻi a me ka leo liʻiliʻi.Hiki iā mākou ke hoʻopuka i nā mea āpau no kāu papahana hui PCB.Loaʻa i kā mākou poʻe ʻenekinia a me kā mākou hui sourcing ka ʻike waiwai i ke kaulahao lako a me ka ʻoihana EMS, me ka ʻike hohonu i ka hui SMT e hiki ai ke hoʻoholo i nā pilikia hana āpau.ʻO kā mākou lawelawe he kumu kūʻai, maʻalahi, a hilinaʻi.Ua ʻoluʻolu mākou i nā mea kūʻai aku ma nā ʻoihana he nui e pili ana i ka lāʻau lapaʻau, ʻoihana, automotive a me nā mea hoʻohana uila.
PCBA hiki
1 | ʻO ka hui SMT me ka hui BGA |
2 | Nā ʻāpana SMD i ʻae ʻia: 0204, BGA, QFP, QFN, TSOP |
3 | Kiʻekiʻe o ka mea: 0.2-25mm |
4 | ʻO ka pahu liʻiliʻi: 0204 |
5 | Min mamao ma waena o BGA: 0.25-2.0mm |
6 | Min BGA nui: 0.1-0.63mm |
7 | Min QFP wahi: 0.35mm |
8 | Ka nui hui min: (X*Y): 50*30mm |
9 | Ka nui hui nui: (X*Y): 350*550mm |
10 | ʻO ka pololei koho koho: ± 0.01mm |
11 | Hiki ke hoʻokomo: 0805, 0603, 0402 |
12 | Loaʻa ke kūpono paʻi helu pine kiʻekiʻe |
13 | Ka mana SMT i kēlā me kēia lā: 80,000 mau helu |
Hiki - SMT
Laina | 9(5 Yamaha,4KME) |
Ka hiki | 52 miliona mau wahi i kēlā me kēia mahina |
Nui Papa Nui | 457*356mm.(18”X14”) |
Min Nui o ka mea | 0201-54 sq.mm.(0.084 sq.inch), hoʻohui lōʻihi, CSP,BGA,QFP |
Ka māmā holo | 0.15 sec/chip,0.7 sec/QFP |
Hiki - PTH
Laina | 2 |
Ka laula o ka papa | 400 mm |
ʻAno | ʻAle pālua |
Kūlana Pbs | Kākoʻo laina alakaʻi ʻole |
ʻO ka mahana kiʻekiʻe | 399 degere C |
Kapu ʻana | mea hoʻohui |
Wela mua | 3 |
Ka Mana Mana
Hoao AOI | Nā ʻike no ka paʻi solderE nānā i nā ʻāpana a hiki i 0201 E nānā i nā ʻāpana nalo, offset, nā ʻāpana hewa, polarity |
Nānā X-Ray | Hāʻawi ʻo X-Ray i ka nānā ʻana i ka hoʻonā kiʻekiʻe o: BGAs/Micro BGAs/Puʻupuʻu pālākiō Chip / Nā papa ʻole. |
Hoao Kaapuni | Hoʻohana maʻamau ka hoʻāʻo ʻana i loko o ka pōʻai me AOI e hōʻemi ana i nā hemahema hana i hoʻokumu ʻia e nā pilikia ʻāpana. |
Ho'āʻo mana | Ka Papahana Mea Hana Kiʻekiʻe TestFlash Hoao hana |
- IOC ka nānā 'ana mai
- SPI solder paste inspection
- Nānā AOI pūnaewele
- Nānā ʻatikala mua SMT
- Loiloi waho
- X-RAY-welding inspection
- Hana hou ka mea hana BGA
- Nānā QA
- Anti-static warehousing a me ka hoʻouna
Palapala
FAQ
ʻOi aku ka nui o ka hāʻawi manawa ma mua o 95%
a), 24 hola huli wikiwiki no ka ʻaoʻao ʻelua prototype PCB
b), 48 hola no 4-8 papa prototype PCB
c), 1 hola no ka helu ʻana
d), 2 hola no ka nīnau ʻenekinia/manaʻo hoʻopiʻi
e), 7-24 mau hola no ke kākoʻo ʻenehana / lawelawe kauoha / hana hana
ʻO ka PCB kahi papa me nā ala keleawe a me nā pale e hoʻopili ai i nā mea uila.ʻO ka PCBA e pili ana i ka hui ʻana o nā ʻāpana ma luna o kahi PCB e hana i kahi mea uila e hana nei.
SHoʻohana ʻia ka paʻi kahiko e hoʻopaʻa i nā mea uila i kahi manawa ma mua o ka hoʻopili mau ʻana i ka PCB i ka wā o ke kaʻina hana reflow.
Iecaianoaaiiuo hiki o wela-kūʻai huahana | |
ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop | Hale Hana PCB Aluminum |
Hiki i ka ʻenehana | Hiki i ka ʻenehana |
Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON | Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe |
Layer: 1 papa i 20 Layer | Layer: 1 papa a me 2 Layer |
Min.line laula: 3mil/3mil(0.075mm/0.075mm) | Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole nui: 0.1mm (dirilling puka) | Min.Ka nui o ka puka: 12mil(0.3mm) |
Max.Nui papa: 1200mm* 600mm | Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in) |
Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm | Pau ka mānoanoa o ka papa: 0.3 ~ 5mm |
Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) | Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz) |
NPTH Hole Hoʻomanawanui: +/-0.075mm, PTH hole hoʻomanawanui: +/-0.05mm | Ka hoʻomanawanui kūlana puka: +/-0.05mm |
Hoʻomanawanui Outline: +/-0.13mm | Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm |
Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. | Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc |
Ka hoʻomanawanui ʻana o ka Impedance: +/-10% | Noho ka mānoanoa hoʻomanawanui: +/-0.1mm |
Hiki ke hana: 50,000 sqm / mahina | MC PCB Hiki i ka hana: 10,000 sqm / mahina |
ʻO kā mākou mau kaʻina hana hōʻoia e like me lalo:
a), Nānā Kiʻi
b), ʻImi lele, mea paahana
c), Ka hoomalu impedance
d), ʻike hiki ke kūʻai
e), ʻeleu ʻeleʻele metallograghic kikohoʻe
f),AOI(Nānā Optical Automated)
Pili o nā mea waiwai (BOM) kikoʻī:
a),Mnā helu o nā mea hana,
b),Chelu ʻāpana o nā mea hoʻolako (eg Digi-key, Mouser, RS )
c), PCBA laʻana kiʻi inā hiki.
d), Ka nui
ʻAʻohe koi MOQ no ABIS no PCB a i ʻole PCBA.
Iecaianoaaiiuo hiki o wela-kūʻai huahana | |
ʻO ʻaoʻao ʻelua/Multilayer PCB Workshop | Hale Hana PCB Aluminum |
Hiki i ka ʻenehana | Hiki i ka ʻenehana |
Nā mea waiwai: CEM-1, CEM-3, FR-4(TG kiʻekiʻe), Rogers, TELFON | Nā mea waiwai: Ke kumu alumini, Ke kumu keleawe |
Layer: 1 papa i 20 Layer | Layer: 1 papa a me 2 Layer |
Min.line laula: 3mil/3mil(0.075mm/0.075mm) | Min.laina laula/wahi: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole nui: 0.1mm (dirilling puka) | Min.Ka nui o ka puka: 12mil(0.3mm) |
Max.Nui papa: 1200mm* 600mm | Nui ka nui o ka papa: 1200mm* 560mm(47in* 22in) |
Ka mānoanoa o ka papa i pau: 0.2mm- 6.0mm | Pau ka mānoanoa o ka papa: 0.3 ~ 5mm |
Ka mānoanoa o ke keleawe: 18um~280um(0.5oz~8oz) | Ka mānoanoa o ke keleawe: 35um~210um(1oz~6oz) |
NPTH Hole Hoʻomanawanui: +/-0.075mm, PTH hole hoʻomanawanui: +/-0.05mm | Ka hoʻomanawanui kūlana puka: +/-0.05mm |
Hoʻomanawanui Outline: +/-0.13mm | Ka hoʻomanawanui outline outline: +/ 0.15mm;ke kuʻi ʻana i ka hoʻomanawanui: +/ 0.1mm |
Hoʻopau ʻia ka ʻili: HASL me ke alakaʻi ʻole, ke gula kaiapuni (ENIG), ke kala kaiapuni, OSP, ka uhi gula, manamana gula, Carbon INK. | Hoʻopau ʻia ka ʻili: ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kālā immersion, OSP etc |
Ka hoʻomanawanui ʻana o ka Impedance: +/-10% | Noho ka mānoanoa hoʻomanawanui: +/-0.1mm |
Hiki ke hana: 50,000 sqm / mahina | MC PCB Hiki i ka hana: 10,000 sqm / mahina |
· Me ABIS, hoʻemi nui nā mea kūʻai aku i kā lākou kumukūʻai kūʻai honua.Ma hope o kēlā me kēia lawelawe i hāʻawi ʻia e ABIS, ua hūnā ʻia kahi mālama kālā no nā mea kūʻai aku.
.Loaʻa iā mākou ʻelua mau hale kūʻai, hoʻokahi no prototype, huli wikiwiki, a me ka hana liʻiliʻi.ʻO ka mea ʻē aʻe no ka hana nui no ka papa HDI, me nā limahana ʻoihana akamai loa, no nā huahana kiʻekiʻe me nā kumukūʻai hoʻokūkū a me ka lawe ʻana i ka manawa.
.Hāʻawi mākou i ke kūʻai aku ʻoihana, kākoʻo loea a me ka logistic, ma ke ao holoʻokoʻa me 24 mau hola o ka manaʻo hoʻopiʻi.