ʻO nā ʻano hoʻopili like ʻole o nā SMD

E like me ke ʻano o ka hui ʻana, hiki ke hoʻokaʻawale ʻia nā ʻāpana uila i nā ʻāpana o loko o ka puka a me nā ʻāpana mauna o luna (SMC).Akā i loko o ka ʻoihana,Nā mea mauna i luna (SMD) hoʻohana hou ʻia e wehewehe i kēia ʻilikaiʻāpana ʻo ia hoʻi hoʻohana ʻia i nā mea uila i kau pono ʻia ma luna o ka ʻili o kahi papa kaapuni paʻi (PCB).Hele mai nā SMD i nā ʻano pahu like ʻole, i hoʻolālā ʻia kēlā me kēia no nā kumu kikoʻī, nā palena ākea, a me nā koi hana.Eia kekahi mau ʻano maʻamau o ka ʻeke SMD:

 

1. SMD Chip (Rectangular) Pūʻolo:

SOIC (Small Outline Integrated Circuit): He pūʻolo ʻāpana ʻāpana me ke alakaʻi ʻēheu gull ma nā ʻaoʻao ʻelua, kūpono no nā kaapuni hoʻohui.

SSOP (Shrink Small Outline Package): E like me SOIC akā me ka liʻiliʻi o ke kino a me ka pitch ʻoi aku ka maikaʻi.

TSSOP (Thin Shrink Small Outline Package): He ʻano lahilahi o SSOP.

QFP (Quad Flat Package): He huinaha a i ʻole ʻāpana ʻāpana me nā alakaʻi ma nā ʻaoʻao ʻehā.Hiki ke haʻahaʻa haʻahaʻa (LQFP) a i ʻole maikaʻi loa-pitch (VQFP).

LGA (Land Grid Array): ʻAʻohe alakaʻi;akā, ua hoʻonohonoho ʻia nā pad pili i loko o kahi pā ma ka ʻili lalo.

 

2. SMD Chip (Square):

CSP (Chip Scale Package): Paʻa loa me nā pōlele solder pololei ma nā ʻaoʻao o ka mea.Hoʻolālā ʻia e kokoke i ka nui o ka chip maoli.

BGA (Ball Grid Array): Hoʻonohonoho ʻia nā pōlele kūʻai i loko o kahi mākia ma lalo o ka pūʻolo, e hāʻawi ana i ka hana wela a me ka uila.

FBGA (Fine-Pitch BGA): E like me ka BGA akā me kahi pitch ʻoi aku ka maikaʻi no ke kiʻekiʻe o nā mea.

 

3. SMD Diode a me nā pūʻolo transistor:

SOT (Small Outline Transistor): Pūʻolo liʻiliʻi no nā diodes, transistors, a me nā mea ʻokoʻa liʻiliʻi ʻē aʻe.

SOD (Small Outline Diode): E like me SOT akā kūikawā no nā diodes.

DO (Diode Outline):  ʻO nā pūʻolo liʻiliʻi like ʻole no nā diodes a me nā mea liʻiliʻi ʻē aʻe.

 

4.SMD Capacitor a me Resistor Packages:

0201, 0402, 0603, 0805.No ka laʻana, hōʻike ka 0603 i kahi mea i ana ʻia 0.06 x 0.03 iniha (1.6 x 0.8 mm).

 

5. Nā Pākē SMD ʻē aʻe:

PLCC (Plastic Leaded Chip Carrier): He huinahā a ʻāpana ʻāpana paha me nā alakaʻi ma nā ʻaoʻao ʻehā, kūpono no nā IC a me nā mea ʻē aʻe.

TO252, TO263, etc.: ʻO kēia nā mana SMD o nā pūʻolo ʻāpana ma waena o ka puka kuʻuna e like me TO-220, TO-263, me kahi lalo palahalaha no ka kau ʻana i luna.

 

Loaʻa i kēlā me kēia ʻano pūʻolo kona mau pono a me nā hemahema e pili ana i ka nui, ka maʻalahi o ka hui ʻana, ka hana wela, nā hiʻohiʻona uila, a me ke kumukūʻai.ʻO ke koho ʻana o ka pūʻolo SMD e pili ana i nā mea e like me ka hana o ka ʻāpana, ka wahi o ka papa i loaʻa, nā mana hana, a me nā koi wela.


Ka manawa hoʻouna: ʻAukake-24-2023